Page 121 - SSAB Welding Handbook Edition 2
P. 121
©2009-2019 by SSAB Group of companies (SSAB). All rights reserved. Only digital PDF file. No distribution. No printing allowed!
No part of this handbook may be reproduced in any form or by any means without permission in writing from SSAB.
Welding handbook 20.0 Hardfacing
Relief cracks Underbead cracks
©SSAB
Relief cracks are rather frequent occurrences in An underbead crack is a kind of hydrogen crack that
hardfacing layers. Other names for this sort of crack can form in the parent metal during a hardfacing
are transverse crack and cross crack. This kind of procedure. If underbead cracks occur, they are located
crack is oriented transverse to the direction of the in the parent metal beneath the hardfacing layers, see
weld metal as the two latter names indicate. fig. 20.9. The risk for underbead cracks is minimized
by following the welding recommendations presented
Commonly, the consumable for the hardfacing in this chapter.
layer is designed to form relief cracks in order to
lower the residual stresses in the welded area,
according to fig. 20.8. This increases the resistance
of the hardfacing layer to spalling from the parent
metal and decreases the residual stresses in the
joint caused by the hardfacing layer. The wear Fig. 20.9: Underbead cracks in the parent metal. The buffer layer is
resistance is not substantially reduced due to this left out in this situation.
type of crack. As is earlier mentioned, the buffer
layer counteracts potential crack propagation from
the hardfacing layer into the parent metal.
Fig. 20.8: Transverse cracks in a hardfacing layer.
This handbook contains general suggestions and information without any expressed or implied warranty of any kind. SSAB hereby expressly disclaims
all liability of any kind, including any damages, in connection with the use of the information and for their suitability for individual applications. 121
It is the responsibility of the user of this brochure to adapt the recommendations contained therein to the requirements of individual applications.