Page 2 - TTS Product Sheet 2023
P. 2
Sigma Series WLCSP Probe Head
Highly parallel, stable test performance for full function wafer testing
WiFi 6+ 5G IoT Automotive
TTS Sigma Series WLCSP Probe Heads are designed to provide optimal performance and signal integrity
for full functional test of high frequency devices in both the HVM wafer testing environment and during lab
qualification. With long pin life, low inductance, and repeatable and stable contact resistance, Sigma Series
Probe Heads can increase first pass yields, reduce maintenance down time, and improve overall cost of test.
TTS uses our internally developed, custom made pins, advanced engineering materials and extensive
simulations to ensure we deliver a product that is capable of high parallelism, tri-temp testing, and works out
of the box each and every time. With pitch capabilities down to 150um, TTS WLCSP products can meet and
exceed all your WLCSP testing needs.
Key features
Pin coplanarity less than 100µm
Pin overdrive greater than 200µm
Short signal length, high compliance pins
Available manual actuator with floating alignment for singulated dies
Easy field maintenance and pin replacement with on-site support available
Tri-temp testing between -40°C to +125°C
Optimized for systems up to 6000 total I/O’s
Pitch from 150µm to 350µm
Suitable for WLCSP, WLBGA, Cu pillar and bare pad probing
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