Page 2 - TTS Product Sheet 2023

Sigma Series WLCSP Probe Head

Highly parallel, stable test performance for full function wafer testing

WiFi 6+ 5G IoT Automotive

TTS Sigma Series WLCSP Probe Heads are designed to provide optimal performance and signal integrity
for full functional test of high frequency devices in both the HVM wafer testing environment and during lab
qualification. With long pin life, low inductance, and repeatable and stable contact resistance, Sigma Series
Probe Heads can increase first pass yields, reduce maintenance down time, and improve overall cost of test.
TTS uses our internally developed, custom made pins, advanced engineering materials and extensive
simulations to ensure we deliver a product that is capable of high parallelism, tri-temp testing, and works out
of the box each and every time. With pitch capabilities down to 150um, TTS WLCSP products can meet and
exceed all your WLCSP testing needs.

Key features

Pin coplanarity less than 100µm

Pin overdrive greater than 200µm

Short signal length, high compliance pins

Available manual actuator with floating alignment for singulated dies
Easy field maintenance and pin replacement with on-site support available

Tri-temp testing between -40°C to +125°C

Optimized for systems up to 6000 total I/O’s

Pitch from 150µm to 350µm

Suitable for WLCSP, WLBGA, Cu pillar and bare pad probing

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