Page 4 - TTS Product Sheet 2023

K-Sigma Series WLCSP Probe Head

High precision measurement for power sensitive wafer testing.

Mobility Automotive Industrial Advanced Process
Nodes

As the demands for precise power delivery increase with the functionality and processing capability of
today’s advanced semiconductor devices, false test failures caused by fluctuating resistance in the test
circuit become more prevalent. To address this issue, many semiconductor manufacturers desire a true
4-Wire Kelvin test to maximize yield and reduce downtime however, the reduced pitch on WLCSP devices
presents many challenges. TTS K-Sigma Series WLCSP Probe Heads utilize custom Kelvin contact
technology to overcome these challenges and provide optimal resistance and voltage measurements on
high-performance devices in both HVM wafer testing and during lab qualification. With the introduction of
TTS’s new K-Sigma Series Probe Heads, our customers now have the ability to carry out full Kelvin testing
of WLCSP devices down to 300um pitch. Our internally developed, custom made pins, advanced
engineering materials and extensive simulations allow us to deliver a product that can increase first pass
yields, reduce maintenance down time, and improve overall cost of test.

Key features

True 4-Wire Kelvin testing on full array or selective I/O’s

Robust probe design for long life and reduced maintenance

Short signal length, high compliance probes
Available manual actuator with floating alignment for singulated dies

Easy field maintenance and probe replacement

Tri-temp testing between -40 to 125°C
Pitch 300μm and greater
Suitable for WLCSP and WLBGA devices

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