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ACS honors DuPont Electronics & Imaging for Chemical Mechanical Planarization (CMP), a key process
in semiconductor fabrication, which supplies the advanced chips needed for smartphones, computing,

the internet of things, vehicles and numerous industrial applications. The CMP process, enabled by
DuPont’s CMP pads, has contributed to the success of semiconductor technology for well over 35 years.

Marty DeGroot
Marty DeGroot is R&D Director for DuPont Industrial Solutions. Marty has 15 years’ experience
in industrial materials innovation, including the fields of catalysis, solar cells/modules, and
chemical mechanical planarization technologies to enable advanced semiconductor nodes.
He has a Ph.D. in Chemistry, 30 granted U.S. patents and more than 25 publications.

Bainian Qian
Bainian Qian, a Technical Fellow at DuPont, was a key contributor to the development and
commercialization of the IkonicTM CMP pad product family. His work in the understanding of
polyurethane chemistry and polymer structure led to breakthroughs in product performance.
He holds 37 US patents.

MaryJo Kulp
Mary Jo Kulp was a Sr. Scientist at Dow/Rohm and Haas. Now retired, Kulp developed and
proved a polymeric hypothesis that resulted in the basis of the VisionPad™ CMP pad family.
Offerings from the VisionPad™ family played a critical enabling role for the introduction of
copper damascene integration.

David B. James
David James was a R&D Manager at Dow/Rohm and Haas. Now retired, he led a team that
demonstrated a lower modulus polyurethane polymer for better contact and an increase in
copper film removal rate. He also coordinated scale-up and manufacturing of the first offerings
in the VisionPad™ pad family.

8 #HeroesofChemistry