Page 43 - ASME INTERPACK 2018 Program
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Technical Sessions
4-4: ULTRA-WIDE-BANDGAP DEVICES 4-8: POWER ELECTRONICS PACKAGING – RELIABILITY TESTING
Sansome, Second Floor Jackson, Second Floor
Session Organizer: Ronald Warzoha, U.S. Naval Academy, Annapolis, MD, Session Organizer: Yunhyeok Im, Samsung Electronics, Hwaseong-si,
United States Gyeonggi-do, Korea (Republic)
Session Co-Organizer: Sukwon Choi, Pennsylvania State University, Session Co-Organizer: Damena Agonafer, Washington University in St.
University Park, PA, United States Louis, St. Louis, MO, United States
Thermal Management oPfreBseetnat-aGtiao2nOO3 nblaysed Field Effect Transistors Using Scanning Probe Microscopy to Investigate Aging Induced
(FETs) (8317) Technical Microstructural Evolution in Lead Free Solders (8490) Technical
Presentation Only
Nitish Kumar, Georgia Institute of Technology, Atlanta, GA, United States,
Zhanbo Xia, Siddharth Rajan, Ohio State University, Columbus, OH, Sudan Ahmed, Jeffrey Suhling, Pradeep Lall, Auburn University, Auburn,
United States, Satish Kumar, Georgia Institute of Technology, Atlanta, GA, AL, United States
United States
Thermal Management of Ultra-Wide Bandgap Ga2O3 Electronics (8453) Investigation of the Effects of High Temperature Aging on the
Technical Presentation Only Mechanical Behavior of Lead Free Solders (8396) Technical Paper
Publication
Bikramjit Chatterjee, Sukwon Choi, Pennsylvania State University,
University Park, PA, United States, Ayayi Ahyi, Sarit Dhar, Auburn Mohammad Alam, KM Rafidh Hassan, Jeffrey Suhling, Pradeep Lall,
Univeristy, Auburn, AL, United States, Ke Zeng, Uttam Singisetti, University Auburn University, Auburn, AL, United States
at Buffalo, Buffalo, NY, United States, wJacob Leach, Kevin Udwary, Kyma
Technologies, Inc., Raleigh, NC, United States, Craig McGray, Modern
Microsystems, Inc., Silver Spring, MD, United States, Eric R. Heller, Air
Force Research Laboratory, Wright-Patterson Air Force Base, OH, United
States
Thermal Characterization of AlGaN/AlN HEMTs for Power Electronics Reliability Characterization of a Packaging Design based on Transient
(8326) Technical Presentation Only Liquid Phase Bonding (8353) Technical Presentation Only
Samuel Kim, Samuel Graham, Georgia Institute of Technology, Lithonia, Paul Paret, National Renewable Energy Laboratory, Golden, CO,
GA, United States United States, Darshan Pahinkar, Samuel Graham, Georgia Institute of
Technology, Atlanta, GA, United States, Sreekant Narumanchi, Douglas
Self-Heating in Ultra-Wide Bandgap AlGaN Channel High Electron DeVoto, Joshua Major, National Renewable Energy Laboratory, Golden,
Mobility Transistors (8352) Technical Presentation Only CO, United States
James Spencer Lundh, Sukwon Choi, Pennsylvania State University,
University Park, PA, United States, Albert G. Baca, Robert J. Kaplar,
Andrew M. Armstrong, Andrew A. Allerman, Thomas Beechem,
Christopher B. Saltonstall, Sandia National Laboratories, Albuquerque,
NM, United States, Eric R. Heller, Air Force Research Laboratory, Wright-
Patterson Air Force Base, OH, United States
K-16 COMMITTEE MEETING 43
Jackson, Second Floor
6:30 PM – 7:30 PM
JOURNAL OF ELECTRONIC PACKAGING (JEP) MEETING
Jackson, Second Floor
7:30 PM – 8:30 PM
