Page 38 - ASME INTERPACK 2018 Program
P. 38
Technical Sessions
TUESDAY, AUGUST, 28
7:00 AM Authors’ Breakfast, Grand Ballroom, Third Floor
8:00 AM TRACK 2 KEYNOTE: SCOTT SCHEELER, CISCO SYSTEMS
Mason I & II, Second Floor
Internet of Things (IoT)
1-2: THERMAL MANAGEMENT APPLICATIONS I 2-1: DATA CENTER COOLING I
Mason II, Second Floor Mason I, Second Floor
Session Organizer: Dhruv Singh, Global Foundries, New York, NY, Session Organizer: Sami Alkharabsheh, Binghamton University,
United States Binghamton, NY, United States
Session Co-Organizer: Timothy Chainer, IBM, Yorktown Heights, NY,
Session Co-Organizer: Winston Zhang, Novark Technologies, Inc., United States
Shenzhen, Guangdong, China
Design of Vapor Chambers with Minimized Thickness (8505) Characterization of Vertically Split Distribution-Wet Cooling Me-
Technical Presentation Only dia Used in Data Centers (8370) Technical Presentation Only
8:45 AM Ryan Lewis, Jason West, Kelvin Thermal, Boulder, CO, United Mullaivendhan Varadharasan, The University o f Texas at Arlington,
9:05 AM States, Yung Cheng Lee, University of Colorado, Boulder, CO, Arlington, TX, United States
9:25 AM United States
A Thermo-mechanical Study on Vertically Split Distribution-Wet
Thermal Management of Hybrid Silicon Microring Laser (8293) Cooling Media Used in Data Centers (8378) Technical Paper
Technical Presentation Only Publication
Wenqing Shen, Satish Kumar, Georgia Institute of Technology, Mullaivendhan Varadharasan, Dereje Agonafer, Ahmed Al
Atlanta, GA, United States, Di Liang, Niru Kumari, Chong Zhang, Khazraji, Jimil M. Shah, Ashwin Siddarth, The University of Texas
Marco Fiorentino, Raymond G Beausoleil, Hewlett Packard at Arlington, Arlington, TX, United States, James Hoverson, Mike
Labs, Palo Alto, CA, United States Kaler, Mestex, a Division of Mestek Inc, Dallas, TX, United States
Lidded vs. Lidless Package Cooling Assessment (8294) Techni- Air Flow Pattern and Path Flow Simulation of Airborne Particulate
cal Paper Publication Contaminants in a High-Density Center Utilizing Airside Econo-
mization (8436) Technical Paper Publication
Xiaopeng Huang, Vadim Gektin, Futurewei Technologies, Santa
Clara, CA, United States Gautham Thirunavakkarasu, Satyam Saini, Jimil M. Shah, Dereje
Agonafer, The University of Texas at Arlington, Arlington, TX, United
States
9:45 AM Interconnect Design Optimization in Ceramic Quad-Flatpack A Review of the State of the Art in Application of Evaporative
10:15 AM No-Lead Devices (8316) Technical Presentation Only Cooling Systems to Data Centers (8391) Technical Paper Publica-
tion
Tse Wong, Raytheon Company, Los Alamitos, CA, United States,
Shea Chen, Raytheon Company, Dallas, TX, United States A. G. Agwu Nnanna, Purdue University Calumet, Hammond, IN,
United States, Michael Okorie, Purdue University Northwest, Ham-
mond, IN, United States
Tea/Coffee Break, Second Floor Foyer
1-1: FUNDAMENTALS OF THERMAL TRANSPORT I 2-7: ADVANCED COOLING TECHNOLOGY
Mason II, Second Floor Mason I, Second Floor
10:30 AM Session Organizer: Krishna Kota, New Mexico State University, Session Organizer: Sruti Chigullapalli, Intel, Phoenix, AZ, United
Las Cruces, NM, United States States
Session Co-Organizer: Vadim Gektin, Futurewei Technologies, Session Co-Organizer: Brad Zakaib, CoolIT, Calgary, AB, Canada,
Santa Clara, CA, United States Shima Hajimirza, Texas A&M, College Station, TX, United States
Phonon Scattering Mechanisms Dictating the Thermal Con- On Material Modeling and Characterization of Thermal Interface
ductivity of Lead Zirconate Titanate (PbZr1-xTixO3 or “PZT”) Materials under Quasi Static Loading Condition (8271) Technical
Thin Films Across the Compositional Phase Diagram (8426) Presentation Only
Technical Presentation Only
Emad A. Poshtan, Bosch, Reutlingen, Germany
Patrick Hopkins, John Gaskins, Jon Ihlefeld, University of Virgin-
ia, Charlottesville, VA, United States, Brian Foley, Georgia Tech,
Atlanta, GA, United States
Multiscale and Multiphysics Computations of Thin Evaporating Next Gen Test-vehicle to Simulate Thermal Load for IoT FPGA
Films (8462) Technical Presentation Only Applications (8300) Technical Paper Publication
38 10:50 AM Kimia Montazeri, Shiwei Zhang, Mohammad Javad Abdolhos- Suresh Parameswaran, Gamal Refai-Ahmed, Suresh Ramalingam
seini Qomi, Yoonjin Won, University of California Irvine, Irvine, CA, Boon Ang, Xilinx, Inc., San Jose, CA, United States
United States
