Page 35 - ASME INTERPACK 2018 Program
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Poster Session
8485 Accelerated Thermal Cycling of Printed Circuit Board for 8499 Enhanced Capillary-driven Boiling in Copper Inverse Opals
Single Phase Immersion Cooling Systems, Surya Duraisamy via Template Sintering, Chi Zhang, Mehdi Asheghi, Juan
8486 Asokan, Jimil M. Shah, The University of Texas at Arlington, 8502 Santiago, Kenneth Goodson, Stanford University, Stanford,
8487 Arlington, TX, United States, Dereje Agonafer, University 8510 CA, United States, James Palko, University of California
8492 of Texas At Arlington, Arlington, TX, United States, David 8512 Merced, Merced, CA, United States, Michael T. Barako, NG
8493 W Sundin, Gary D Testa, Engineered Fluids, LLC, Tyler, TX, 8549 Next, Northrop Grumman Aerospace Systems, Redondo
8494 United States 8551 Beach, CA, United States
8496 8556
8497 Computational study of Form Factor of 3rd Generation 8570 Surface Plasmon Effects on the Interfacial Heat Transport
8498 Open Compute Servers using different Dielectric Fluids for Processes in Gold Nanorods, Andrew Kelliher, University of
Single-phase Immersion Cooling, Pranavi Rachamreddy, Virginia, Charlottesville, VA, United States, Brian B. Lynch,
Ravya Dandamudi, Jimil M. Shah, Dereje Agonafer, Joseph B. Tracy, North Carolina State University, Raleigh,
University of Texas at Arlington, Arlington, TX, United States, NC, United States, Patrick Hopkins, University of Virginia,
David W Sundin, Gary D Testa, Engineered Fluids, LLC, Tyler, Charlottesville, VA, United States
TX, United States
Measurement of the Thermal Performance of a Single-
CFD Simulation-based Artificial Neural Network Modelling Phase Immersion Cooled Server at Elevated Temperatures
for Data Center Cooling Prediction, Nikita R Sukthankar, for Prolonged Time, Pratik Bansode, Jimil M. Shah, Gautam
Abhishek Walekar, Ashwin Siddarth, Dereje Agonafer, Gupta, Dereje Agonafer, University of Texas at Arlington,
University of Texas at Arlington, Arlington, TX, United States Arlington, TX, United States
Energy and Stress Based Design for Reliability Using Design of Nanostructured Copper Surfaces for Thin Film
Alternative Interconnect Reliability Test Methodology, Evaporation, Jessica Lee, Quang Pham, Kimia Montazeri,
Mahsa Montazeri, David Huitink, University of Arkansas, Yoonjin Won, University of California, Irvine, Irvine, CA, United
Fayetteville, AR, United States, Cody Marbut, University of States
Arkansas - Fayetteville, Springdale, AR, United States
Performance Enhancement of PCM-based Heat Sinks
Characterization of the Thermal Performance of a 3-D Using Gradient Porous Thermal Conductivity Enhancer for
Manifold for High-Power Density Inverter Designs, Joseph Electronics Cooling, Ali Ghahremannezhad, University of
Schaadt, Stanford University, Sunnyvale, CA, United States California, Riverside, Riverside, CA, United States
Psychrometric Bin Analysis for Data Center Cooling Modes Full Chip-Scale Numerical Simulation on Heterogeneous
using Artificial Neural Networks, Abhishek Walekar, Nikita R Integrated Fan-out Wafer Level Packaging (InFO-WLP),
Sukthankar, Ashwin Siddarth, University of Texas Arlington, Daixing Wang, Yufeng Jin, School of Electronic and
Arlington, TX, United States Computer Engineering, Peking University Shenzhen Graduate
School, Shenzhen, China, Yudan Pi, Peking University, Beijing,
Creep Response of Assemblies Bonded with Pressure Beijing, China, Wei Wang, Peking University, National Key Lab
Sensitive Adhesive (PSA) Hao Huang, Abhijit Dasgupta, of Micro/Nano Fabrication Technology, Beijing, China
University of Maryland, College Park, College Park, MD,
United States Thermal Response of Ultrawide Bandgap AlGaN-AlN Power
Devices, Samuel Kim, Georgia Institute of Technology,
Elastic Properties of Few-Grained Sac Solder Joints Based Atlanta, GA, United States, Samuel Graham, Georgia Institute
on Anisotropic Multi-Scale Predictive Models, Qian Jiang, of Technology, Lithonia, GA, United States
Abhijit Dasgupta, University of Maryland, College Park,
College Park, MD, United States Measurement of Microstructure Changes During Solder
Aging Using Real-Time Scanning Probe Microscopy, Jeffrey
Thermal Degradation of Passive Components for use in Suhling, Sudan Ahmed, Pradeep Lall, Auburn University,
Single Phase Immersed Cooling Application, Keerthivasan Auburn, AL, United States
Padmanaban, Jimil M. Shah, Dereje Agonafer, University of
Texas at Arlington, Arlington, TX, United States, Gary D Testa,
David W Sundin, Engineered Fluids, LLC, Tyler, TX, United
States
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