Page 31 - ASME INTERPACK 2018 Program

Panel Sessions

Amy Fleischer, Jie Xue,
California Polytechnic State University (Cal Poly), San Cisco, CA
Luis Obispo, CA’

Dr. Fleischer is Dean of the College of Engineering at the California Jie Xue leads Cisco’s Technology and Quality organization, a global team
Polytechnic State University (Cal Poly). Cal Poly Engineering offers 14 responsible for delivering customer-driven quality and reliability solutions
bachelors and 11 master’s degree programs and enrolls more than 6,000 in support of all Cisco’s product portfolio. The team drives a competitive
students. Cal Poly Engineering offers 14 bachelors and 11 master’s degree advantage for Cisco by ensuring innovation and excellence in
programs and enrolls more than 6,000 students. She was at Villanova manufacturing technology, test and component engineering, advanced
University for 18 years before moving to Cal Poly and received her Ph.D. in technology development, and closed-loop quality management. Prior to
Mechanical Engineering from the University of Minnesota in 2000. Dean joining Cisco, Jie held several management and engineering positions at
Fleischer currently serves on the Executive Committee of ASME’s Motorola, Inc., working on R&D and product development. Jie is an IMAPS
Electronics and Photonics Packaging Division and served as Chair of the Fellow and IEEE Fellow. She has published more than 90 technical papers,
ASME Heat Transfer Division K-16 Technical Committee on Electronics and holds 15 patents. Jie holds a Bachelor of Science from Tsinghua
Thermal Management from 2009-2011. Dr. Fleischer was recognized as the University in Beijing, China and a Master of Science and PhD from Cornell
ASME Electronics and Photonics Packaging Division (EPPD) 2010 Women University.
Engineer of the Year and was awarded the 2011 ASME K-16/ EPPD Clock
Award in recognition of her outstanding and continuing contributions to
the science and engineering of heat transfer in electronics. She is an
Associate Editor of the Journal of Heat Transfer and a past Associate
Editor of the Journal of Electronic Packaging. Dean Fleischer’s research
interests include the broad topics of sustainable energy system design
and thermal management of electronic systems. Recent research projects
have included energy storage in phase change materials, waste heat
recovery from data centers, development of energy absorbing building
materials, and development of nano-enhanced materials including
graphite nanofiber thermal interface materials.

Leslie Phinney,
Sandia National Laboratories, Albuquerque, NM

Dr. Phinney is Principal Member of Technical Staff at Sandia National
Laboratories. Her research is focused on heat transfer, thermosciences,
and microsystems, with an emphasis on microscale heat transfer, thermal
analysis and simulation, thermal microactuators, experimental techniques,
laser processing, adhesion in microsystems, and microelectromechanical
systems (MEMS) reliability testing.She has an M.S. and Ph.D. in Mechanical
Engineering from the University of California at Berkeley and a B.S. in
Aerospace Engineering from the University of Texas at Austin. She is a
Fellow of the American Society of Mechanical Engineers. She is a recipient
of a National Science Foundation CAREER Award and a 2017 Society of
Women Engineers Prism Award.

31