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Panel Sessions
Rahima Mohammed, TRACK 3 PANEL: INTEGRATION OF SENSORS WITH FLEXIBLE
Intel Corporation, Santa Clara, CA SYSTEMS FOR IIOT
WEDNESDAY, AUGUST 29, 2018
10:30 AM –12:00 PM
ROOM: MASON II, SECOND FLOOR
Dr. Rahima Mohammed is a Senior Principal Engineer at Intel Corporation Abstract: Industrial Internet of Things (IIOT) use cases require customized
and currently leads the “Delight Customer Program Office” in the form factors to integrate sensing systems into the user’s unique workflows.
Performance, Power and Competitive Analysis team in Manufacturing These applications in structural monitoring, health care and industrial
Validation Performance (MVP) team of Intel. wearables impose challenging microelectronic packaging requirements.
This multi-disciplinary panel will share their experience in research,
Prior to this, she served as a Data Center Customer Solutions Technologist technology development, design and systems integration related to these
in Manufacturing Validation Engineering (MVE) and led the data mining key challenges.
efforts on customer returned parts. She has been with Intel over 19 years
after completing graduate schooling from Yale. Before joining MVE, she Valerie Marty,
served as the advanced test module technologist, path finding czar for Moderator, Connected Micro LLC, OR
strategic emerging technologies across market segments and also setup
the innovation programs for the division. She also chairs various technical Valerie Marty is the founder of Connected Micro LLC providing consulting
steering committees and serves on Industry advisory boards. She has services for research teams navigating commercialization challenges.
published 100+ papers in Intel internal and external conferences and filed Valerie contributed to the advancement of CMOS and MEMS technologies
5 patents. She serves as a reviewer for various conferences like ITherm, at Hewlett Packard as an R&D engineer and later became the Global
InterPACK, and a program committee member of IEEE Semi-therm Technical Communities Lead for HP Labs. In 2014, Valerie became a Hall of
conference and Burn-in-test strategies workshop. She served as the Fame Inductee within the MEMS & Sensors Industry Group and an alumni
vice-program chair, program chair, and general chair of Semi-therm of the MSIG Technical Advisory Committee. Valerie holds an MS in
conferences in 2014, 2015, and 2016, respectively. Rahima has a strong Physical Chemistry from Oregon State University.
passion for mentoring and coaching and hence, has served as the senior
advisor for Women at Intel Network of Guadalajara, Mexico for the past 8
years, and a TechWomen technical mentor of 2011 and 2012. She has been
working with GHC and AnitaB.
Abhijit Dasgupta, Jeff Bergman,
University of Maryland, College Park, MD Acellent Technologies, Sunnyvale, CA
Abhijit Dasgupta is Jeong H. Kim Professor of Mechanical Engineering at Mr. Jeffrey Bergman is the Director of Engineering Marketing at Acellent
the University of Maryland (UMD), with research experience in the Technologies Inc. He received a BSE from Calvin College and MSE
microscale and nanoscale mechanics and reliability physics of engineered degrees in both Civil and Electrical Engineering from the University of
materials used in conventional and additively manufactured 3D flexible Michigan where he pursued graduate research in the field of Structural
electronic packaging and intelligent microsystems. He holds a Ph.D. in Health Monitoring (SHM) for bridges. Mr. Bergman has been engaged in
Theoretical and Applied Mechanics from the University of Illinois at his current role with Acellent Technologies since 2013 where he works on
Urbana-Champaign (UIUC), and has been a principal investigator at the the development of SHM technology for application in a wide range of
Center for Advanced Life Cycle Engineering (CALCE) at UMD for the past fields including: Oil & Gas, Aerospace, Defense, and Automotive. His work
30 years, conducting research in reliability physics, design for reliability, has been presented in over a dozen technical papers and presentations
accelerated stress testing, and real-time health management. He is an covering the development, testing and application of structural monitoring
ASME Fellow, past Chair of the ASME Electronic and Photonic Packaging systems.
Division (EPPD), current member of the ASME Design, Manufacturing and
Materials Segment Leadership Team (DMM-SLT) and Reliability Topic Lead
in one of the Technical Working Groups (TWGs) of the Heterogeneous
Integration Roadmap (HIR) Team.
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