Page 22 - ASME INTERPACK 2018 Program
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Workshops
principal investigator at the Center for Advanced Life Cycle Engineering University, manager of Research and Development at Varian Associates,
(CALCE) at UMD for the past 30 years, conducting research in reliability founding President of the Semiconductor Equipment Group of Varian
physics, design for reliability, accelerated stress testing, and real-time Associates and general Partner of Patricof & Co. Ventures. Dr. Bottoms has
health management. He is an ASME Fellow, past Chair of the ASME served as Chairman and CEO of many companies both public and Private.
Electronic and Photonic Packaging Division (EPPD), current member of the
ASME Design, Manufacturing and Materials Segment Leadership Team Biography: Mark Shaw is Director of Hardware Engineering for Microsoft’s
(DMM-SLT) and Reliability Topic Lead in one of the Technical Working Cloud and AI Division, responsible for the architecture and hardware
Groups (TWGs) of the Heterogeneous Integration Roadmap (HIR) Team. designs of Compute & Storage platforms utilized in Azure’s cloud scale
services. Mark is leading the Project Olympus open source hardware
Biography: Dr. Rockwell Hsu is a Technical Leader at Cisco Systems, Inc. development effort with the Open Compute Project to bring leading edge
where he leads an initiative on advanced semiconductor packaging technology to the community. Microsoft’s Open Compute Project servers
development for 112 Gbps and beyond for network equipment and SI/PI have been deployed at massive scale across a global fleet of data
development for network line cards used in switches and routers. Prior to centers. Mark’s team is responsible for delivering leading-edge
Cisco, he led RF and server CPU packaging development at Intel. Dr. Hsu technology as the HGX-1 GPU AI accelerator and SmartNIC FPGA
holds one US patent. Dr. Hsu was the chair of the High-Speed, Wireless & accelerator. Mark holds over 30 patents in computing systems and
Components Committee for the IEEE Electronic Component Technology hardware. Prior to Microsoft, Mark was a Distinguished Technologist at
Conference (ECTC) and has been a member of the ECTC since 2006. Dr. Hewlett-Packard and cut his teeth designing systems, platform controllers,
Hsu was the chair of Santa Clara Valley Chapter of the IEEE Antennas and CPUs and coherent interconnects at Gould and Convex Supercomputers.
Propagation Society (APS).
Biography: Meyya Meyyappan is a fellow of IEEE, ASME, MRS, ECS, AVS,
Biography: Dr. Bottoms received a B.S. degree in Physics from IOP, AIChE and National Academy of Inventors. He has received numerous
Huntington College in Montgomery, Alabama in 1965, and a Ph.D. in Solid awards including a Presidential Meritorious Award and Induction into
State from Tulane University in New Orleans in 1969 and is currently Silicon Valley Engineering Council Hall of Fame.
Chairman of Third Millennium Test Solutions. He has worked as a faculty
member in the department of electrical engineering at Princeton
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