Page 17 - ASME INTERPACK 2018 Program

Award Luncheon Speakers

When I joined Toshiba in 1981, I was assigned to a group involved in EPPD, JEP, INTERPACK, AND K-16 AWARDS LUNCHEON
thermal management of equipment and I knew that the study of cooling THURSDAY, AUGUST 30, 2018
technology for electronic equipment had become very popular in the 12:00 PM - 1:30 PM
United States. At that time, Toshiba had focused on developing small ROOM: GRAND BALLROOM, THIRD FLOOR
laptop computers using small cooling fans. Therefore, as I was in the
Research & Development center, and I indirectly became involved in the Starting this year, the Annual K-16 Clock Award will be presented at the
small laptop computer project. InterPACK conference. K-16 is the joint committee of the EPPD and Heat
Transfer Division (HTD). The K-16 Clock Award is given to an individual who
In addition, various developmental topics emerged from the has outstanding and continuing contributions to the science and
manufacturing sites, but when I myself sought for research topics, I was at engineering of heat transfer in electronics. The candidate should also be
a loss about what to do. I took a hint from someone that my research active in the K-16 and EPPD activities (chairing Tracks, Panels, sessions,
should focus on a very slow flow in natural air cooled electronic equipment teaching courses, presenting papers at ASME/K-16 sponsored events) as
casings. Therefore, I began to evaluate the flow resistance coefficients of well as being leaders in their respective fields. Awards for years 2017 as
perforated plates used in the outlet vents of electronic equipment. I tried well as 2018 will be presented at the luncheon. The recipients of the Clock
to obtain the flow resistance values of small velocity flows, using energy Awards are:
balance and buoyancy balance, and by these means. I obtained the
resistance values for such perforated plates. I presented these results at 2018 – Dr. Sreekant Narumanchi
the ASME Winter Annual Meeting, held in New Orleans in December 1984.
2018 – Dr. Mehmet Arik
Through my participation in the conferences, I gained many valuable
friends, such as, Dr. Wataru Nakayama and Avram Bar-Cohen. There are, I 2017 – Dr. Victor Chiriac
am afraid, too many to mention, but together they constitute a great
treasure to me. After that, my research and development work has The awards luncheon will provide a forum to present the annual
expanded, into fields such as the development of methods to apply Electronics Packaging & Photonics Division (EPPD) awards that span the
thermal analysis to electronic equipment design, the development of following categories (a) Excellent in Mechanics, (b) Women Engineer
cooling technology based on phase change, and so on. I have pursued Award, (c) Early Career Award, and (d) Student Member Award.
applied research in these fields, and have studied the development of a
self-cooling system utilizing low- temperature waste heat from electronic The recipients of the ASME Journal of Electronics Packaging (JEP) will
equipment. honored at the luncheon, which includes the (a) Best Paper of 2018, (b)
Associate Editor of the Year, (c) Associate Editor Service, and (d) Reviewer
Biography: Dr. Masaru Ishizuka is currently the President of Toyama of the Year award.
Prefectural University. He received a Ph.D. in Mechanical Engineering,
from the University of Tokyo in 1981, joined Toshiba, and worked as The 2018 InterPACK best and outstanding paper and poster awards will
“Toshiba Chief Thermal Architect”. He has been a leading member of the also be presented. The awardees are selected based on a review by the
Heat Transfer Field specializing in thermal design and management awards committee with inputs from the comments by the paper reviewers
techniques for a wide spectrum of electronic systems. He joined Toyama and track chairs. The contributions of the InterPACK ’18 organizing
Prefectural University in 2000 as an associate professor and took an office committee members, authors, volunteers, and ASME staff will also be
as a professor in 2003, the Dean of Engineering Faculty in 2011, President recognized.
in 2013. Dr. Ishizuka is also actively involved in the development of
practical thermal analysis approaches being applied to various electronic
equipment designs. His research resulted in several patents and over 250
technical publications. He serves on several editorial boards including
ASME Journal of Electronic Packaging and has organized numerous
conferences. He is a Fellow of ASME and JSME and has received
numerous awards including the “2006 Outstanding Contribution Award”,
Heat Transfer Division, JSME and “2010 Outstanding Contribution Award”,
K-16 committee, ASME.

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