Page 14 - ASME INTERPACK 2018 Program

Track Keynotes
TRACK 3: STRUCTURAL AND PHYSICAL HEALTH MONITORING
WEDNESDAY, AUGUST 29, 2018
8:00 AM - 8:45 AM
ROOM: JACKSON, SECOND FLOOR
Daniel Gamota,
Jabil, San Jose, CA
“Structural and Physical Health Monitoring: Industrialization of
Electronics Architectures for IIoT/IoT and Wearables Products”
Abstract: The acceleration of technology discovery and advancement
(designs, materials, processes, and manufacturing equipment) is creating
opportunities for new families of structural and physical health monitoring
products. In addition, customers are demanding customizable solutions
which is fueling manufacturing industry changes that must be addressed “Gen3 Embedded Cooling for Wide Bandgap Power Amplifiers”
quickly. At a minimum, customers are expecting access to the most
advanced technologies (flexible hybrid electronics, soft materials, energy
harvesting components, etc.) and a turn-key agile manufacturing solution.
They demand manufacturing options that provide end-product
customization while maintaining access to scalable high volume, high mix
production services that offer them flexibility to address speed to
commercialization and market demand shifts.
The ability to successfully manufacture products that use novel materials,
advanced processes, and unique equipment platforms requires
disciplined innovation. Flexible hybrid electronics (FHE) offers functionality
that provides product designers unbounded freedom to realize innovative
products. An established supply chain and robust guidelines will assist
designers to exercise FHE technologies to realize highly differentiated
products. As FHE technology transitions from R&D Push to Product
Designer Pull, it is critical for Standards Development Organizations (IPC,
IEC, IEEE, etc.), Industry Trade Associations (SEMI, IPC, SGIA, etc.), and
Innovation Institutes to establish several critical assets: 1) well developed
supply chain (e.g. materials, equipment, and manufacturing platforms), 2)
robust standard operating procedures (e.g. consumables storage,
materials acceptance standards, certificates of compliance), 3) established
design rules (e.g. flex, rigid-flex, ultra thin die), and 4) rigid manufacturing thermal management of microelectronics, the IEEE Electronic Packaging
processes (e.g. handling and presentation of ultra thin die, processing
environment – temperature, humidity) and equipment (e.g. pick & place,
dispensing, curing, in-line/off-line inspection tools). These activities are
necessary to ensure that FHE based products meet consumer demands
for in-field performance.
Biography: Daniel Gamota is Vice President of the Digital Engineering
Services Organization at Jabil. He is leading several international sites that
are developing and deploying hardware innovations in medical, industrial,
energy, consumer, aerospace, automotive, and defense products.
Prior to joining Jabil, Gamota was director and fellow of the technical staff systems.
at Motorola. He was elevated to IEEE Fellow and was named a Dan Noble
Fellow at Motorola (top 0.1% of engineers) for his contributions to the fields Bar-Cohen is a former Editor-in-Chief of the IEEE CPMT Transactions and
14 of manufacturing, microelectronics, nanotechnologies, and printed &
flexible electronics.
Gamota earned a Ph.D. in Engineering from the University of Michigan and
an M.B.A. from the Kellogg School of Management, Northwestern
University.
TRACK 4: POWER ELECTRONICS, ENERGY CONVERSION AND
STORAGE
THURSDAY, AUGUST 30, 2018
8:00 AM - 8:45 AM
ROOM: JACKSON, SECOND FLOOR
Avram Bar-Cohen,
Raytheon – Space and Airborne Systems, Rosslyn, VA
Abstract: Successful utilization of the inherent capability of wide bandgap
materials and architectures for RF power amplifiers necessitates the
creation of an alternative, Gen3, thermal management paradigm. Recent
Gen3 “embedded cooling” efforts in the aerospace industry have focused
on overcoming the near-junction thermal limitations of conventional
electronic materials through the use of diamond substrates and enhancing
removal of the dissipated power with on-chip convective and jet
impingement microfluidics.
Following the introduction of a modified Johnson Figure-of-Merit (JFOM-k),
which includes thermal conductivity to reflect this thermal limitation,
attention is turned to the options, challenges, and techniques associated
with the development of embedded thermal management technology.
Record GaN-on-Diamond power fluxes, in excess of 500W/mm2, and heat
fluxes, above 400W/mm2, achieved in DARPA’s NJTT program, are
described. Raytheon’s ICECool demonstration MMICs, which achieved 3.1×
the CW RF power output and 4.8× the CW RF power density relative to a
baseline design, are used to illustrate the efficacy of Gen3 embedded
cooling.
Biography: Dr. Avram Bar-Cohen is an internationally recognized leader in
Society President for 2018-2019 and Life Fellow of IEEE, as well as
Honorary Member of ASME, and is currently serving as a Principal
Engineering Fellow at Raytheon Corporation – Space and Airborne
Systems. His publications, lectures, short courses, and research, as well as
his US government and Professional service in IEEE and ASME, have
helped to create the scientific foundation for the thermal management of
electronic components and systems. His current efforts focus on
embedded cooling, including two-phase microchannel coolers, on-chip
thermoelectrics, and diamond substrates for high heat flux electronic and
photonic components in computational, radar, and directed energy
has represented the Society as a Distinguished Lecturer for more than 15
years. He recently completed his service as a Program Manager in the
Microsystem Technology Office at the Defense Advanced Projects