Page 10 - ASME INTERPACK 2018 Program
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Sponsors
It is with great appreciation that we acknowledge this year’s sponsors!
Their support, generosity and collaboration allows this conference to
maintain its high standards of excellence.
PLATINUM SPONSOR HUST
GE Additive Thermal Packaging Laboratory (TPL) is affiliated to the School of Energy
Heat Sink Competition and Power Engineering, Huazhong University of Science and Technology
We thank GE Additive for their generous support of the 2018 InterPACK (HUST) in Wuhan city of China. HUST is a top ten university in China. TPL
Conference! has rich experience in solving thermal and fluid issues in electronics
packaging and works on industrial and academic projects which relate to
GOLD SPONSORS thermal management, manufacturing materials and processes of
electronic systems. This lab has designed and commercialized the
hydrodynamically levitated micro-pump and liquid cooling garment.
For more information please visit our website:
http://TPL.energy.hust.edu.cn
ASE GROUP INTEL
Alongside a broad portfolio of established technologies, ASE is also Intel invents at the boundaries of technology to make amazing
delivering innovative advanced packaging and System-in-Package experiences possible for business and society, and for every person on
solutions to meet growth momentum across a broad range of end markets. Earth. Harnessing the capability of the cloud, the ubiquity of the Internet of
For more about our advances in SiP, WLP, Fan Out, MEMS, Flip Chip, and, Things, the latest advances in memory and programmable solutions, and
2.5D, 3D & TSV technologies, all ultimately geared towards applications to the promise of always-on 5G connectivity, Intel is disrupting industries and
improve lifestyle and efficiency, please visit: aseglobal.com. To follow ASE solving global challenges. Leading on policy, diversity, inclusion,
on Twitter: @asegroup_global education and sustainability, we create value for our stockholders,
customers, and society.
For more information please visit our website:
www.aseglobal.com For more information please visit the website:
Intel.com/California or https://www.intel.com/content/www/us/en/
corporate-responsibility/intel-in-california.html
CISCO Stanford nanoHeat
Cisco designs and sells a broad range of technologies that have been Heat Sink Competition
powering the Internet since 1984. Across networking, security, We thank nanoHeat for their generous support of the 2018 InterPACK
collaboration, and the cloud, our evolving intent-based technologies are Conference!
constantly learning and adapting to provide customers with a highly
secure, intelligent platform for their digital business.
For more information please visit the website:
10 thenetwork.cisco.com
