Page 7 - ASME INTERPACK 2018 Program
P. 7
Schedule at a Glance
THURSDAY, AUGUST 30
TIME SESSION # EVENT ROOM
Authors’ Breakfast Grand Ballroom
7:00AM - 7:45AM Bosch Keynote: Microsensors Research and Development at Bosch Mason I & II
Raytheon Keynote: Gen3 Embedded Cooling for Wide Bandgap Power Jackson
8:00AM - 8:45AM 1-Keynote Amplifiers
Technical Sessions Mason I
8:00AM - 8:45AM 4-Keynote Server Cooling II Mason II
Mechanical Reliability I Sansome
8:45AM - 10:15AM 2-4 Power Electronics Thermal Management – System Level Jackson
3-3 Packaging Materials Second Floor Foyer
10:15AM - 10:30AM 4-14 Tea/Coffee Break
10:30AM - 12:00PM 5-2 Technical Sessions Mason I
Design and Characterization Mason II
12:00PM - 1:30PM 1-6 Mechanical Reliability II Sansome
1:30PM - 3:00PM 3-5 Power Electronics Packaging – Functional Materials Jackson
1:30PM - 3:00PM 4-9 Package and System Reliability Grand Ballroom
5-1 Lunch / Awards Mason II
Reliability Considerations for Flexible Hybrid Electronics Tutorial
1-4 Technical Sessions Mason I
4-16 Microsystems Packaging Sansome
Power Electronics Thermal Management – Thermoelectrics and Emerging
3:00PM - 3:15PM 5-3 Cooling Techniques Jackson
3:15PM - 4:45PM Electronics for Novel Drivetrain Technologies Second Floor Foyer
4-17 Tea/Coffee Break
4-18 Technical Sessions Sansome
Batteries, Photovoltaics and Energy Harvesting Devices Jackson
Low Dimensional Materials and Nanoscale Heat Transfer
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