Page 4 - ASME INTERPACK 2018 Program
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Schedule at a Glance

   MONDAY, AUGUST 27

   TIME              SESSION #  EVENT                                                                          ROOM

   8:00AM - 12:00PM             Tours to Cisco, PARC, Stanford, and UC Berkeley                                Jackson
                                Material Characterization for Harsh Environment Electronics Tutorial           Sansome
   2:00PM - 3:30PM              How to Qualify Your Batteries to Prevent Failures and Thermal Events Tutorial  Mason I
                                Thermal Stress Failures in Electronic Packaging: Prediction and Prevention
   2:00PM - 3:30PM              Tutorial                                                                       Pyramid Ballroom
                                EPPD Meeting
   2:00PM - 4:00PM              InterPACK Leadership Dinner

   4:45PM - 6:15PM
   6:30PM - 8:30PM

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