Page 4 - ASME INTERPACK 2018 Program
P. 4
Schedule at a Glance
MONDAY, AUGUST 27
TIME SESSION # EVENT ROOM
8:00AM - 12:00PM Tours to Cisco, PARC, Stanford, and UC Berkeley Jackson
Material Characterization for Harsh Environment Electronics Tutorial Sansome
2:00PM - 3:30PM How to Qualify Your Batteries to Prevent Failures and Thermal Events Tutorial Mason I
Thermal Stress Failures in Electronic Packaging: Prediction and Prevention
2:00PM - 3:30PM Tutorial Pyramid Ballroom
EPPD Meeting
2:00PM - 4:00PM InterPACK Leadership Dinner
4:45PM - 6:15PM
6:30PM - 8:30PM
4