Page 2 - ASME INTERPACK 2018 Program
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Welcome

   K N,                           WELCOME LETTER

    GENERAL CONFERENCE CHAIR      On behalf of the ASME Electronic and Photonic Packaging Division (EPPD), welcome to the 2018
                                  International Technical Conference on Packaging and Integration of Electronic and Photonic
       X L,                       Microsystems (InterPACK) at the Hilton San Francisco Financial District in San Francisco, CA,
                                  August 27-30, 2018.
        GENERAL CONFERENCE
               CO-CHAIR           The InterPACK Conference is ASME EPPD’s flagship conference and has a long history of
                                  providing a forum to disseminate and share information on cutting-edge research in the areas of
     S G,                         packaging and reliability of electronic devices for researchers in Academia, Government, and
                                  Industry, and the 2018 meeting will continue with that tradition. The organizers have developed a
    CONFERENCE PROGRAM CHAIR      comprehensive technical program, with nearly 185 technical papers and presentations, as well as
                                  posters, tutorials, panels, workshops, and keynotes aligned with areas of heterogenous
                                  integration, servers of the future, wearable devices, power electronics, and automotive
                                  electronics. The conference program is set up to promote networking between the attendees,
                                  offering opportunities to foster collaboration.

                                  This year, we also emphasized on the Internet of Things (IOT) and the vast role that packaging will
                                  play to advance this area of technology. We are pleased to offer new workshops – the Robotics,
                                  Maker and AI, and Additively Manufactured Heat Sink Workshops. We sincerely thank the Design,
                                  Materials, and Manufacturing (DMM) Segment Leadership for supporting the workshops with the
                                  TEC Development Funds. Also new to this year’s program, we are happy to offer four tours that
                                  will provide the opportunity to the conference attendees to visit some of the top industry and
                                  university sites. The tours will cover Cisco Systems, PARC, Stanford University, and University of
                                  California Berkeley.

                                  We hope that you will enjoy the exciting program that has been organized for you by numerous
                                  volunteers including track chairs, session chairs, workshop/panel moderators, tutorial organizers,
                                  and technical paper reviewers. We thank them as well as the staff at ASME for the many hours
                                  put into making this a high-quality conference and look forward to enjoying the outcome of their
                                  hard work. We also thank all our sponsors across the globe for their generous support as well as
                                  participation.

                                  We wish you the very best as you attend InterPACK 2018!

   SN                          ,  Kaustubh Nagarkar,
   CONFERENCE PROGRAM CO- CHAIR   General Conference Chair

                                  Xiaobing Luo,
                                  General Conference Co-Chair

                                  Samuel Graham,
                                  Conference Program Chair

                                  Sreekant Narumanchi,
                                  Conference Program Co- Chair

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