Page 16 - ASME INTERPACK 2018 Program
P. 16
Award Luncheon Speakers
INTERPACK ACHIEVEMENT AWARD LUNCHEON SPEAKER also led to high-performance, cost-effective cooling solutions for high-end
TUESDAY, AUGUST 28, 2018 microprocessors and the proliferation of photo-mechanics techniques
12:00 PM – 1:30 PM used for thermo-mechanical stress model validation. Ravi has written
ROOM: GRAND BALLROOM, THIRD FLOOR several book chapters and more than 30 papers on topics related to his
The prestigious InterPACK Achievement Award is presented to a single area of expertise.
individual once every year at the ASME InterPACK Conference. Awardees Ravi joined Intel in 1992 after earning a bachelor’s degree from Bombay
have demonstrated excellence and international recognition in research University, a master’s degree from the University of Houston, and a Ph.D.
and development related to electronic packaging, as well as service to the from Lehigh University, all in mechanical engineering. His contributions
technical community at large. during his Intel career have earned him numerous industry honors,
including the SRC’s 2015 Mahboob Khan Outstanding Industry Liaison
Award, the 2016 THERMI award from SEMITHERM and the 2016 Allan
Ravi V. Mahajan, Kraus Thermal Management Medal from the American Society of
Intel Corporation, Chandler, Arizona Mechanical Engineers. He has been nominated as an IEEE CPMT
Distinguished Lecturer. He is one of the founding editors for the Intel
Assembly and Test Technology Journal (IATTJ) and currently VP of
Publications & Managing Editor-in-Chief of the IEEE Transactions of the
“Past Perspectives and Future Directions in Advanced Packaging CPMT. Additionally, he has been long associated with ASME’s InterPACK
Technology” conference and was Conference Co-Chair of the 2017 Conference. Ravi is
a Fellow of two leading societies, ASME and IEEE. He was named an Intel
Abstract: This talk will provide a perspective of how packaging has Fellow in 2017.
evolved over the past few decades, to meet the demands of a continually
evolving semi-conductor roadmap. It will them focus on upcoming
opportunities and challenges in Heterogeneous ALLAN KRAUS THERMAL MANAGEMENT MEDAL & INTERPACK/ISPS
Integration. Heterogeneous Integration (HI) of disparate computing and KEYNOTE LUNCHEON SPEAKER
communications functions is a key enabler of performance in micro- WEDNESDAY, AUGUST 29, 2018
electronics systems. HI is crucially enabled by advanced packaging since 12:00 PM - 1:30 PM
packages are an optimal HI platform. This talk will address the role of ROOM: GRAND BALLROOM, THIRD FLOOR
packaging in enabling HI and will focus primarily on the technology
evolution of package interconnect densities. It will show how packaging The Allan Kraus Thermal Management
has evolved to provide increased interconnect density and how the Medal recognizes an individual who has
different technology solutions available today meet the demands of demonstrated outstanding achievements
diverse markets. The talk will also touch on the evolving future challenges in thermal management of electronic
in interconnect density scaling. In addition to interconnect scaling, this systems and his or her commitment to the
talk will also briefly discuss challenges and opportunities in key areas such field of thermal science and engineering.
as power management, high speed IO, thermal management and test. The nominee for the award should have:
Biography: Ravi Mahajan is an Intel Fellow and the Co-director of Significant contributions in thermal
Pathfinding and Assembly and Packaging technologies for 7nm silicon and management of electronic systems
beyond in the Technology and Manufacturing Group at Intel Corporation. demonstrated by successful product
He is responsible for planning and carrying out multi-chip package development, seminal papers, filed
pathfinding programs for the latest Intel process technologies. Ravi also patents and/or leadership of research and development programs. The
represents Intel in academia through research advisory boards, Thermal Management Award was established in 1994 by the Electronic
conference leadership and participation in various student initiatives. and Photonic Packaging Division and operated as a divisional award until
2009, when it was elevated to a Society Award and renamed the Allan
Ravi has led efforts to define and set strategic direction for package Kraus Thermal Management Medal.
architecture, technologies and assembly processes at Intel since 2000,
spanning 90nm, 65nm, 45nm, 32nm, 22nm and 7nm silicon. Earlier in his
Intel career, he spent five years as group manager for thermal mechanical Masaru Ishizuka,
tools and analysis. In that role, Ravi oversaw a Thermal-Mechanical Lab Toyama Prefectural University, Tokyo, Japan
chartered with delivering detailed thermal and mechanical
characterization of Intel’s packaging solutions for current and future
processors.
A prolific inventor and recognized expert in microelectronics packaging “How I Came to Research the Cooling of Electronic Equipment”
16 technologies, Ravi holds more than 40 patents, including the original Abstract: I am greatly honored to have received this wonderful award,
patent for a silicon bridge that became the foundation for Intel’s “The Allan Kraus Thermal Management Medal. In this talk, I will describe
Embedded Multi-Die Interconnect Bridge technology. His early insights the process of how I came to research the cooling of electronic equipment.
