Page 18 - ASME INTERPACK 2018 Program
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Tutorials
7-1 - MATERIAL CHARACTERIZATION FOR HARSH ENVIRONMENT Biography: Dr. Przemyslaw Gromala is a simulation senior expert at Robert
ELECTRONICS Bosch GmbH, Automotive Electronics in Reutlingen. Currently, he is
MONDAY, AUGUST 27, 2018 leading an international simulation team and FEM validation lab with the
2:00 PM – 3:30 PM main focus on implementation of simulation driven design for electronic
ROOM: JACKSON, SECOND FLOOR control modules and multi-chip power packaging for hybrid drives. His
research activities focus on virtual pre-qualification techniques for
Przemyslaw Jakub Gromala, development of the electronic control modules and multi-chip power
Robert Bosch GmbH, Reutlingen, Germany packaging. His technical expertise includes material characterization and
modeling, multi-domain and multi-scale simulation including fracture
mechanics, verification techniques and prognostics and health
management for future safety related electronic smart systems.
Fabian Welschinger, Prior to joining Bosch, Dr. Gromala worked at the Delphi Development
Robert Bosch GmbH, Renningen, Germany Center in Krakow, as well as at the Infineon Research and Development
Center in Dresden.
He holds a PhD in mechanical engineering from Cracow University of
Technology in Poland.
Abstract: Epoxy-based polymers are widely used in the semiconductor Biography: Dr. Fabian Welschinger is a research engineer at Robert Bosch
industry as thermal and/or electrical interfaces and as encapsulating GmbH, Corporate Sector Research and Advanced Engineering in
material. In the automotive industry, epoxy-based molding compounds Renningen. His research focuses on the development and implementation
(EMC) are often used to protect not only the single IC packages but also of simulation methods for plastic materials including elastomers, reinforced
the entire electronic control units (ECUs) or the power modules. The stress thermoplastics, and epoxy-based materials. His technical expertise
caused by the mismatch of the coefficient of thermal expansion (CTE) includes the investigation of failure mechanisms in (reinforced) plastic
between EMC and adjacent materials is one of the major causes for materials on different length scales, the transport of relevant information
premature failure. In the temperature range of interest, the mold material onto the component scale, and the development of nonstandard
used in the specific applications exhibits a highly nonlinear behavior. characterization techniques.
Especially around the glass transition temperature, a dominant nonlinear
viscous characteristic of the mold material can be observed. During Prior joining Robert Bosch GmbH, Dr. Welschinger worked as a research
operation of the aforementioned applications, the epoxy-based polymers associate at the Institute of Applied Mechanics, University of Stuttgart,
are subjected to elevated temperatures around the glass transition Germany. He holds a PhD in Civil- and Environmental Engineering and the
temperature, where the material exhibits significant volumetric and SimTech Cluster of Excellence from the University of Stuttgart.
isochoric viscosity. In contrast, at low temperatures, epoxy-based
polymers show an ideal elastic characteristic with brittle fracture behavior. 7-2 - RELIABILITY CONSIDERATIONS FOR FLEXIBLE HYBRID
This complex material characteristic in the full temperature range of ELECTRONICS
interest renders the design of electronic control units a nontrivial task. THURSDAY, AUGUST 30, 2018
Regarding an accelerated development process, the aforementioned 1:30 PM – 3:00 PM
material mechanisms have to be taken into account by suitable simulation ROOM: MASON II, SECOND FLOOR
strategies.
This tutorial will address details of such strategies, summarize the required Allyson Hartzell,
material characterization procedure, and will close with some Veryst Engineering, Needham Heights, MA
representative examples.
Abstract: The focus of this tutorial is the reliability of flexible hybrid
electronics primarily in wearable systems. For the purpose of this talk, the
system includes flexible interconnects, yet also the MEMS and sensors
and packaging. The entire systems hierarchy must all be well designed,
processed and without killer defects. This tutorial webinar will cover some
of the newer MEMS and sensor devices with advanced packaging and
flexible interconnects, and how to assess field failure mechanisms, identify
18 failure mechanisms and statistically model reliability.
