Page 23 - ASME INTERPACK 2018 Program
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Panel Sessions

TRACK 1 PANEL: CHALLENGES IN ADVANCED PACKAGING FOR                                                    Gamal Refai-Ahmed,
HARSH ENVIRONMENTS                                                                                     Co-Moderator, Xilinx, San Jose, CA
TUESDAY, AUGUST 28, 2018
1:30 PM – 3:00 PM                                                             Dr. Gamal Refai-Ahmed, Life Fellow ASME, Fellow Canadian Academy of
ROOM: MASON II, SECOND FLOOR                                                  Engineering, is a Distinguished Engineer and Adjunct Professor in the
                                                                              Watson School of Engineering and Applied Science SUNY Binghamton.
Abstract: Electronics packaging in harsh environments continues to be a       He obtained the M. A. SC. and PhD degrees in Mechanical Engineering
key technological challenge that limits overall system performance and        from the University of Waterloo. He is the author of more than 90 technical
reliability in multiple applications despite advances in underlying           papers and more than 100 US patents/International Patents/ Pending
technologies. This panel will bring together leading experts from             patents. He is an Associate Editor of the Journal Components and
academia and industry to present a perspective on key technological           Packaging, IEEE and Journal of Thermal Sciences and Engineering and
challenges as well as opportunities in this important direction. Industry     Applications, Transactions of the ASME.
panelists will specifically focus on case studies of advances in electronics
packaging that have led to successful products. Panelists from academia                                Pradeep Lall,
will provide an overview of recent fundamental research advances in this                               Auburn University, Auburn, AL
field. The panel will also discuss harsh environment packaging in the
context of the rapidly evolving supply chain environment in the
microelectronics and MEMS industry.

                          Ankur Jain,
                          Moderator, University of Texas, Arlington, TX

Ankur Jain is an Associate Professor in the Mechanical and Aerospace          Pradeep Lall is the MacFarlane Endowed Professor in the Department of
Engineering Department at the University of Texas, Arlington, USA. He         Mechanical Engineering and the Director of NSF Center for Advanced
directs the Microscale Thermophysics Laboratory (www.uta.edu/mtl),            Vehicle and Extreme Environment Electronics at Auburn University. He
which carries out experimental and theoretical research on heat transfer      serves on the Technical Council and Governing Council of NextFlex
and energy conversion in Li-ion batteries, microscale thermal transport,      Manufacturing Institute. Dr. Lall is author and co-author of 2-books, 14
bioheat transfer, microelectromechanical systems, etc. He received the        book chapters, and over 500 journal and conference papers in the field of
Lockheed Martin Excellence in Teaching Award (2018), UTA College of           electronics reliability, safety, energy efficiency, and survivability. Dr. Lall is
Engineering Outstanding Early Career Award (2017), NSF CAREER Award           a Fellow of IEEE, Fellow of the ASME, and Fellow of the Alabama Academy
(2016) and the ASME EPP Division Young Engineer of the Year Award             of Sciences. Dr. Lall is a recipient of the NSF’s Alex Schwarzkopf Award for
(2013). Dr. Jain was among a small group of US-based researchers invited      Technology Innovation, Alabama Academy of Science Wright A, Gardner
by the US National Academy of Sciences to participate in the 5th              Award, IEEE Exceptional Technical Achievement Award, ASME-EPPD
Arab-American Frontiers of Science, Engineering, and Medicine                 Applied Mechanics Award, SMTA’s Member of Technical Distinction Award,
Symposium in 2017. He received his Ph.D. (2007) and M.S. (2003) in            Auburn University’s Creative Research and Scholarship Award, SEC
Mechanical Engineering from Stanford University, where he received the        Faculty Achievement Award, Samuel Ginn College of Engineering Senior
Stanford Graduate Fellowship (SGF) and his B.Tech. (2001) in Mechanical       Faculty Research Award, Three-Motorola Outstanding Innovation Awards,
Engineering from the Indian Institute of Technology (IIT), Delhi with the     Five-Motorola Engineering Awards, and Twenty Best-Paper Awards at
highest GPA among the class of Mechanical Engineering. He has                 national and international conferences. Dr. Lall has served in several
published 53 high quality journal articles on topics related to energy        distinguished roles at national and international level including serving as
conversion and heat transfer in batteries, microelectronics and biological    member of National Academies Committee on Electronic Vehicle Controls,
systems. His research has been supported by National Science                  Member of the IEEE Reliability Society AdCom, IEEE Reliability Society
Foundation, Department of Energy, Office of Naval Research, Indo-US           Representative on the IEEE-USA Government Relations Council for R&D
Science & Technology Forum, etc.                                              Policy, Chair of Congress Steering Committee for the ASME Congress,
                                                                              Member of the technical committee of the European Simulation
                                                                              Conference EuroSIME, and Associate Editor for the IEEE Transactions on
                                                                              Components and Packaging Technologies.

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