Page 27 - ASME INTERPACK 2018 Program

Panel Sessions
Mary Ann Maher,
SoftMEMS LLC, Santa Clara, CA
Mary Ann received her Ph.D. degree in 1989 from Caltech in the area of
semiconductor device modeling. She then moved to the Swiss Center for
Electronics and Microtechnology (CSEM) in Neuchatel, Switzerland. She
joined Tanner Research in 1992 becoming the software architect for their
IC design tools. She moved to MEMSCAP in 1999 as an Executive Vice
President and became the company’s CTO in 2001. She founded
SoftMEMS LLC in 2004 to address the need for co-design tools for
systems incorporating MEMS sensors, electronics and packaging.
Janos Veres,
Program Manager, Printed Electronics, PARC Flex, CA the personal computers (wave 1) and the smart phones (wave 2).
Janos Veres leads PARC’s Novel and Printed Electronics Program
exploring the Future of Electronics. He is passionate about the future of
manufacturing and the new ecosystems enabled by digital technologies.
His main interest is exploring 2D and 3D printing and large area processes
for electronic devices to merge form and function and to “free electronics
from the box”. By combining novel materials, device designs and unique
deposition processes, it becomes possible to print flexible circuits,
sensors, memory and hybrid electronic systems. Janos creates projects
that combine experts in technology, design, user experience and
systematic innovation. Janos has held R&D, manufacturing and
management positions in material, printing and electronics companies
including PolyPhotonix, Kodak, Merck, Avecia, Zeneca and Gestetner.
Janos holds a Ph.D. in Solid State Electronics from Imperial College,
London.
Benjamin Leever,
Air Force Research Laboratory (AFRL), Dayton, OH
Benjamin is currently a Senior Materials Engineer AFRL’s Soft Matter
Materials Branch. His primary roles are as the Advanced Development
Lead and Government Chief Technology Officer of NextFlex, a $170M
public-private partnership established to create a domestic manufacturing
ecosystem in flexible hybrid electronics. He earned a B.S. in Chemical
Engineering from the University of Cincinnati and a Ph.D. in Materials
Science & Engineering from Northwestern University.
TRACKS 4 & 5 PANEL: VEHICULAR POWER ELECTRONICS
WEDNESDAY, AUGUST 29 2018
TIME: 3:15 PM– 4:45 PM
ROOM: JACKSON, SECOND FLOOR
Abstract: Vehicular electronics represents the third wave of electronics
most prominently. Power electronics is heterogeneously integrated
together with various sensor and communication technologies into highly
miniaturized units. These systems are exposed to harsh field conditions,
yet need to show highest reliability and functional safety. They must be
fabricated with maximum efficiency in order to find their intended mass
market. Then, the impact of these products on the lives of the people
around the globe will be as fundamental and disruptive as it has been for
After a brief survey on these effects, the joint panel of InterPACK Tracks 4
& 5, will discuss various aspects and contributions that allow coping with
the great engineering and research challenges related to this new wave of
electronics technologies, from the industrial perspective of OEM, tier 1 and
technology suppliers, from the academic perspective of universities and
research organizations, and from the governmental and societal
perspective.
Sven Rzepka,
Fraunhofer ENAS, Chemnitz, Germany
Sven Rzepka is head of the Micro Materials Center (MMC) at Fraunhofer
ENAS and professor for ‘smart systems reliability’ at TU Chemnitz,
Germany.
He joined Fraunhofer in 2009 after working as Principal for simulation at
Qimonda and Infineon. In 2002, he graduated from Dresden University of
Technology with PhD and habilitation degrees. Dr. Rzepka has been
working in Backend and BEoL technologies for 30 years with 25 years
experience in microelectronics and smart systems reliability and
simulation. He has published his engineering work in more than 150
papers and technical talks around the world. He is involved in international
conference committees and organizes the annual European Expert
Workshop on Reliability of Electronics and Smart Systems (EuWoRel). Prof.
Rzepka has been member of IEEE for 28 years, Euceman for 9 years, as
well as a member of ASME. Serving as a member of the Executive
Committee of the European Technology Platform EPoSS, he has frequently
been involved in evaluation, road mapping, and policy making processes
advising the European Commission and the national authorities.
27