Page 32 - ASME INTERPACK 2018 Program
P. 32
Poster Session
TUESDAY, AUGUST 28, 2018
6:30 PM – 8:30 PM
ROOM: GRAND BALLROOM, THIRD FLOOR
8207 Fabrication of Nanolens Arrays on Fluoropolymer Films for 8330 Experimental Investigation of Thin-film Droplet Evaporation
8213 Improving the Light Extraction Efficiency of Deep Ultraviolet 8331 on Porous Micropillar Structures, Li Shan, Binjian Ma, Shuai
8220 LEDs Renli Liang, Jiangnan Dai, Shuai Wang, Linlin Xu, 8347 Shuai, Zichen Du, Damena Agonafer, Washington University
8221 Changqing Chen, Huazhong University of Science and 8359 in St. Louis, St. Louis, MO, United States
8269 Technology, Wuhan, China 8360
8303 Size Effects on the Cross-Plane Thermal Conductivity
Investigation on Thermal Performance of DUV-LEDs 8369 of Transparent Conducting Indium Tin Oxide (ITO) and
8304 Fabricated on AlN Ceramic Substrate with Copper Filled 8373 Fluorine Tin Oxide (FTO) Thin Films, David Olson, Christina
Hole, Linlin Xu, Renli Liang, Jiangnan Dai, Changqing Chen, 8377 M. Rost, John Gaskins, Chester Szwejkowski, Jeffrey Braun,
8318 Huazhong University of Science and Technology, Wuhan, Patrick E. Hopkins, University of Virginia, Charlottesville, VA,
8319 China United States
8329
Significant Anisotropic Optical Properties of Heteroepitaxial Thermal Characterization of Si Photonic Ring Modulator,
Strained Nonpolar A-plane ZnO layers Grown on AlxGa1-xN Wenqing Shen, Satish Kumar, Georgia Institute of
Templates, Jingwen Chen, Jiangnan Dai, Changqing Chen, Technology, Atlanta, GA, United States, Niru Kumari, Marco
Huazhong University of Science and Technology, Wuhan, Fiorentino, Raymond G Beausoleil,Hewlett Packard Labs,
China Palo Alto, CA, United States, Ashkan Seyedi, Hewlett Packard
Enterprise, Palo Alto, CA, United States
Temperature-dependent Photoluminescence of DUV LED
Multiple Quantum Wells under Strain Effect, Hanling Long, Path flow Simulation of Airborne Particulates for the
Changqing Chen, Jiangnan Dai, Jingwen Chen, Renli Liang, Implementation of Effective Strategies to Mitigate
Huazhong University of Science and Technology, Wuhan City, Contamination in a Data Center, Satyam Saini, Gautham
Hubei, China Thirunavakkarasu, Jimil M. Shah, Dereje Agonafer, The
University of Texas at Arlington, Arlington, TX, United States
Controlled Assembly of Charged Nanoparticles by Using
Electrostatic Forces, Eliza Sopubekova, E. Yegan Erdem, Thermal Management of Ultra-Wide Bandgap Ga2O3
Bilkent University, Ankara, Turkey Electronics, Bikramjit Chatterjee, Sukwon Choi,
Pennsylvania State University, University Park, PA, United
Direct Laser Writing for Enhanced Boiling on Flexible States, Ayayi Ahyi, Sarit Dhar, Auburn University, Auburn,
Surfaces, Daeyoung Kong, Tung Xuan Tran, Jung Bin In, AL, United States, Ke Zeng, Uttam Singisetti, University
Hyoungsoon Lee, Chung-Ang University, Seoul, Dongkaj-gu, at Buffalo, Buffalo, NY, United States, Jacob Leach, Kevin
Korea (Republic) Udwary, Kyma Technologies, Inc., Raleigh, NC, United States,
Craig McGray, Modern Microsystems, Inc., Silver Spring, MD,
Embedded Microfluidic Pin-fin Arrays for High Performance United States, Eric R. Heller, Air Force Research Laboratory,
3D ICs, Daeyoung Kong, Hyoungsoon Lee, Chung-Ang Wright-Patterson Air Force Base, OH, United States
University, Seoul, Dongkaj-gu, Korea (Republic), Chirag
Kharangate, Case Western Reserve University, Cleveland, Multifunctional Chip for Use in Thermal Analysis of
OH, United States, Ki Wook Jung, Stanford, Menlo Park, Power Systems, David Gonzalez-Nino, Pedro O. Quintero,
CA, United States, Joseph Schaadt, Stanford University, University of Puerto Rico - Mayaguez, Mayaguez, PR, United
Sunnyvale, CA, United States, Mehdi Asheghi, Kenneth States, Lauren M. Boteler, Damian P. Urciuoli, Dimeji Ibitayo,
Goodson, Stanford University, Stanford, CA, United States US. Army Research Laboratory, Adelphi, MD, United States,
Iain M. Kierzewski, General Technical Services, LLC, Wall
Structural and Thermal Study of Self Regulating Flow Township, NJ, United States, U.S., University of Puerto Rico -
Control Device for Dynamic Cooling of Electronic Cooling, Mayaguez, Mayaguez, PR, United States
Rajesh Kasukurthy, The University of Texas at Arlington,
Arlington, TX, United States Phonon Scattering Effects in the Thermal Conductivity
Reduction of Ion Irradiated Diamond, Ethan Scott, University
Thermal Management of Beta-Ga2O3 based Field Effect of Virginia, Charlottesville, VA, United States
Transistors (FETs), Nitish Kumar, Satish Kumar, Georgia
Institute of Technology, Atlanta, GA, United States, Zhanbo Development and Validation of the Deliquescent Relative
Xia, Siddharth Rajan, Ohio State University, Columbus, OH, Humidity Test Method for the Accumulated Particulate
United States Matter Found in a Data Center Utilizing an Airside
Economizer, Roshan Anand, Jimil M. Shah, Gautham
Numerical Investigation on Optimizing Micro Elliptical Pin- Thirunavakkarasu, Dereje Agonafer, The University of Texas
fin Microchannel for Electronic Cooling, Zichen Du, Shuai at Arlington, Arlington, TX, United States, Prabjit Singh, IBM
Shuai, Binjian Ma, Li Shan, Damena Agonafer, Washington Corp., Poughkeepsie, NY, United States, Mike Kaler, Mestex,
University in St. Louis, St. Louis, MO, United States, Baris Division of Mestek, Dallas, TX, United States
Dogruoz, Cisco Systems Inc., Santa Clara, CA, United States
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