Page 30 - ASME INTERPACK 2018 Program
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Panel Sessions
Judy Priest, Rahima Mohammed,
Cisco Systems, CA Intel Corporation
Dr. Grupen-Shemansky is a Distinguished Engineer in the Chief Rahima Mohammed is a Senior Principal Engineer at Intel Corporation and
Technology and Architecture Office at Cisco Systems. She explores currently leads the “Delight Customer Program Office” in the Performance,
emerging technologies and architectures impacting strategic product Power and Competitive Analysis team in Manufacturing Validation
areas by developing proof of concepts for assessments, such as IoT, AI, Performance (MVP) team of Intel. Prior to this, she served as a Data Center
and blockchain. Judy has over 30 years of experience in applied Customer Solutions Technologist in Manufacturing Validation Engineering
electromagnetics used in high speed signaling and optics for silicon and (MVE) and led the data mining efforts on customer returned parts. She has
data center products. She has worked in circuit and interconnect design, been with Intel over 19 years after completing graduate schooling from
ASICs and packaging, and system architectures for microprocessors, Yale. Before joining MVE, she served as the advanced test module
compute, storage, graphics, and network switch platforms. Judy is a technologist, path finding czar for strategic emerging technologies across
recognized industry expert and is frequently invited to speak at market segments and also setup the innovation programs for the division.
international electronics and packaging conferences, and has participated She also chairs various technical steering committees and serves on
in several IEEE and JEDEC standards committees. Judy has been at Cisco Industry advisory boards. She has published 100+ papers in Intel internal
for 15 years, and previously worked at Digital Equipment Corporation, and external conferences and filed 5 patents. She serves as a reviewer for
Hewlett Packard, Silicon Graphics, and Atheros Communications, as well various conferences like ITherm, InterPACK, and as a program committee
as startup ventures. Judy has chaired the Industry Advisory Board for GHC member of IEEE Semi-therm conference and Burn-in-test strategies
(Grace Hopper Celebration), and chaired conference session committees workshop. She served as the vice-program chair, program chair, and
on IoT and HCI. Judy is the Executive Technical Advisor for Cisco’s WISE general chair of Semi-therm conferences in 2014, 2015, and 2016,
(Women in Science and Engineering), focusing on the recruitment, respectively. Rahima has a strong passion for mentoring and coaching and
development, and advancement of technical women. hence, has served as the senior advisor for Women at Intel Network of
Guadalajara, Mexico for the past 8 years, and a TechWomen technical
Melissa Grupen-Shemansky, mentor of 2011 and 2012. She has been working with GHC and AnitaB
SEMI, Milpitas, CA since 2011.
Dr. Grupen-Shemansky is Chief Technology Officer at SEMI for flexible Melany L. Hunt,
electronics and advanced packaging. She directs R&D consortia and SEMI Caltech, Pasadena, Ca
governing and technical councils comprised of government, industry, and
university experts. Melissa has over 25 years of experience in the Dr. Hunt is the Dotty and Dick Hayman Professor of Mechanical
semiconductor industry at various levels of management in research and Engineering at Caltech. Her research work involves transport and
development, manufacturing, business development, and technology mechanics in multiphase systems, including granular material flows,
strategy. Melissa began her career at Motorola, Semiconductor Products booming sand dunes, dense liquid-solid flows, fluidized beds, powders,
Sector and subsequently worked at Lucent, Bell Labs as Director of and porous materials. She received her bachelor’s degree from the
Interconnect and Design, and AMD/Spansion as Vice President of University of Minnesota, Minneapolis and her masters and doctorate from
Packaging and Interconnect Technology. Prior to joining SEMI, Dr. the University of California, Berkeley. After graduating from Berkeley, she
Grupen-Shemansky was the Senior Vice President of Engineering for began at Caltech as an assistant professor in 1988. At Caltech, she has
Advanced Nanotechnology Solutions, Inc, a startup in 3D ICs and served as vice chair of the Caltech faculty, as the executive officer of
cybersecurity. She serves on the Advisory board for BRIDG in Neo City, mechanical engineering (2002-07), and most recently as vice provost
FL. Dr. Grupen-Shemansky holds both bachelor’s and master’s degrees in (2007-14). In the role of vice provost, she oversaw Caltech’s academic and
Chemical Engineering from Pennsylvania State University and a Ph.D. in educational programs, including offices supporting teaching, learning and
Chemical Engineering from Arizona State University. She has received outreach; accreditation; student-faculty programs; and institutional
various corporate and educational awards, has seven issued patents, research and assessment. Since stepping down as vice provost, she has
numerous technical publications, and is a contributing author to Failure- returned to full time teaching and research; she continues as one of
Free Integrated Circuit Packages. Caltech’s Deputy Title IX coordinators.
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