Page 33 - ASME INTERPACK 2018 Program
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Poster Session
8384 Nanoporous Metals from Block Copolymer Templates for 8429 Investigation of the Effects on Mechanical and Optical
Enhanced Surface Area Boiling, Joseph Katz, Kenneth 8431 Reliability of Active Optical Cables under Immersion In A
8397 Goodson, Chi Zhang, Tanya Liu, Mehdi Asheghi, Stanford 8433 Single-Phase Dielectric Coolant, Hrishabh Singh, Jimil M.
8399 University, Stanford, CA, United States, Michael T. Barako, NG 8438 Shah, Dereje Agonafer, The University of Texas at Arlington,
8400 Next, Northrup Grumman Corporation, Redondo Beach, CA, 8439 Arlington, TX, United States
United States 8450
8404 Computational Analysis of Form Factor Study, Study of
8406 High Temperature Aging of Lead Free Solders for Extreme 8457 Impact of Thermal Shadowing and Customization of Heat
8409 Environments, Mohammad Alam, KM Rafidh Hassan, 8458 Sink for Single-Phase Immersion Cooled 3rd Generation
8412 Jeffrey Suhling, Pradeep Lall, Auburn University, Auburn, AL, 8459 Open Compute Server, Jimil M. Shah, Dereje Agonafer,
8415 United States 8463 University of Texas at Arlington, Arlington, TX, United States
8418
8419 Optimized FEA Modeling of PBGA Assemblies Subjected to Experimental Analysis of a Single-Phase Direct Liquid
Thermal Cycling, Chienchih Chen, Jeffrey Suhling, Pradeep Cooled Server Performance at Extremely Low Temperatures
Lall, Auburn University, Auburn, AL, United States for Extended Time Periods, Gautam Gupta, Pratik Bansode,
Jimil M. Shah, Dereje Agonafer, The University of Texas at
Piezoresistive Stress Sensors on 4H-SiC, Jun Chen, Richard Arlington, Arlington, TX, United States
Jaeger, Auburn University, Auburn, AL, United States, Jeffrey
Suhling, Auburn University, Auburn University, AL, United Flow Network Analysis and Optimization of Liquid
States, Leonid Fursin, United Silicon Carbide, Monmoth, NJ, Cooling Loop in an Isolated Hybrid Cooled Server, Uschas
United States Chowdhury, Manasa Sahini, Dereje Agonafer, University of
Texas at Arlington, Arlington, TX, United States
The Effects of Aging on the Cyclic Stress-Strain Behavior
and Hysteresis Loop Evolution of Bi-Doped SAC Solder A Steady-State Thermoreflectance Method to Measure
Materials, Md Mahmudur Chowdhury, Nianjun Fu, Sudan Thermal Conductivity, Jeffrey Braun, David Olson, Patrick
Ahmed, Jeffrey Suhling, Sa’d Hamasha, Pradeep Lall, E. Hopkins, University of Virginia, Charlottesville, VA, United
Auburn University, Auburn, AL, United States States
The Mechanical Behavior of Solder Mask, Promod Thermal Characterization of Ultra-Wide Bandgap Lateral
Chowdhury, Jeffrey Suhling, Pradeep Lall, Auburn University, Power Devices Using 2D Materials, James Spencer
Auburn, AL, United States Lundh, Tianyi Zhang, Amritanand Sebastian, Saptarshi
Das, Mauricio Terrones, Sukwon Choi, Pennsylvania State
Temperature Dependent Mechanical Behavior of University, University Park, PA, United States, Sanyam
Intermetallic Compounds in Pb-Free Solder Joints, Abdullah Bajaj, Fatih Akyol, Siddharth Rajan Ohio State University,
Fahim, Sudan Ahmed, Jeffrey Suhling, Pradeep Lall, Auburn Columbus, OH, United States
University, Auburn, AL, United States
POL-kW - A Wirebond-less Packaging Technology for
Measurement of The Poisson’s Ratio of SAC Lead Free Power Electronics, Liang Yin, Christopher Kapusta,
Solders, KM Rafidh Hassan, Mohammad Alam, Jeffrey General Electric, Niskayuna, NY, United States, Arun Gowda,
Suhling, Pradeep Lall, Auburn University, Auburn, AL, United Kaustubh Nagarkar, GE Global Research, Niskayuna, NY,
States United States
Evolution of the Microstructure of Lead Free Solders Fundamental Study of Polymer to Metal Bonding on
Subjected to Mechanical Cycling, Mohd Aminul Hoque, Md Integrated Circuit Packaging, Dinesh Thanu, Intel
Mahmudur Chowdhury, Jeffrey Suhling, Sa’d Hamasha, Corporation, Chandler, AZ, United States
Pradeep Lall, Auburn University, Auburn, AL, United States
Evaluation of Thermal Coupling Effect with Multichip Power
Quantification of Aging Induced Microstructural Evolution in Modules, Xuhui Feng, Kevin Bennion, Gilbert Moreno,
Lead Free Solders, Jing Wu, Jeffrey Suhling, Pradeep Lall, National Renewable Energy Laboratory, Golden, CO, United
Auburn University, Auburn, AL, United States States
Development of a Novel Liquid Cooled Battery Module for Multiscale and Multiphysics Computations of Thin
Electric Vehicles with Seamless Second Life, Kshitij Gupta, Evaporating Films, Kimia Montazeri, Shiwei Zhang,
Zhe Gong, Carlos Da Silva, Olivier Trescases, Cristina H. Mohammad Javad Abdolhosseini Qomi, Yoonjin Won,
Amon, University of Toronto, Toronto, ON, Canada University of California Irvine, Irvine, CA, United States
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