Page 28 - ASME INTERPACK 2018 Program
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Panel Sessions
Sukwon Choi, Ercan M. Dede
Moderator, Pennsylvania State University, State Toyota Research Institute of North America,
College, PA Ann Arbor, MI
Sukwon Choi is currently an assistant professor of mechanical engineering Ercan M. Dede received his B.S. degree and Ph.D. in mechanical
at the Pennsylvania State University. He received the B.S. degree in engineering from the University of Michigan and an M.S. degree in
mechanical engineering (2005) and M.S. degree in automotive mechanical engineering from Stanford University. Currently, he is a Senior
engineering (2007) from Hanyang University, Seoul, Korea. He received Research Manager in the Electronics Research Department at the Toyota
the Ph.D. degree in mechanical engineering from Georgia Institute of Research Institute of North America. His group focuses on vehicle systems
Technology (2013). He continued research at Sandia National Laboratories involving sensors, power semiconductors, advanced circuits, packaging,
as a postdoctoral appointee in the Microsystems Science and Technology and thermal management technology. He has over 55 issued patents and
Center (2013-2015). His research is currently focused on the study of has published more than 50 articles in archival journals and conference
high-power ultra-wide bandgap electronics and low-power devices based proceedings on topics related to design and structural optimization of
on two-dimensional layered materials. thermal, mechanical, and electromagnetic systems. He is an author of a
book entitled, ``Multiphysics Simulation: Electromechanical System
Gereon Meyer, Applications and Optimization.’’ His team has received two R&D 100
VDI/VDE Innovation + Technik in Berlin, Germany Awards for the development of technologies related to next-generation
power electronics for electrified vehicles.
Dr. Gereon Meyer is head of Strategic Projects with the Future Klas Brinkfeldt
Technologies and Europe Department of VDI/VDE. Innovation + Technik. Swerea IVF, Sweden
He is leading a team of experts concerned with future trends in
transportation and the enabling role of smart electronic systems. He is the Dr. Klas Brinkfeldt received his PhD from the Swedish Institute of Space
rapporteur for research and innovation roadmaps on the electrification Physics, Umeå University, Sweden in 2006. He has worked on sensors
and automation of road transport on behalf of public authorities, industry and instrumentation for European space projects and MEMS devices for
and academia, in particular the European Technology Platform on Smart particle measurements in space. He has also worked in the automotive
Systems Integration (EPoSS). Moreover, he is the chairman of the industry mainly with the electrical systems of Volvo cars. Since 2009, he is
International Forum on Advanced Microsystems for Automotive working at the Swedish research institute Swerea IVF where his research
Applications (AMAA), and the editor of the Springer book series Lecture focus is packaging and reliability of power electronics and sensors for
Notes in Mobility. harsh environments.
Martin Niessner Dr. Lauren Boteler
Infineon Technologies AG, Neubiberg, Germany U.S. Army Research Laboratory (ARL), Adelphi, MD
Dr. Martin Niessner received his Ph.D. in electrical engineering with first
class honors from Technische Universitaet Muenchen (TUM), Munich, Dr. Lauren Boteler leads the thermal and packaging research programs as
Germany. part of the Advanced Power Packaging group at the U.S. Army Research
From 2006 to 2012, he was a researcher and teaching assistant with the Laboratory (ARL). She received her B.S. and Ph.D. degrees in mechanical
MEMS group of Dr. Habil. G. Schrag and Prof. G. Wachutka at TUM, engineering from the University of Maryland in 2006 and 2011,
focusing on the systematic characterization and physics-based multi- respectively. Her work at ARL, beginning in 2005, has focused on
energy-domain coupled simulation of MEMS devices. Since 2012, he is electronics packaging and thermal management solutions for a wide
with the package simulation team at Infineon Technologies AG, Neubiberg, range of Army applications. She designs thermal and packaging solutions
Germany. His work focuses on reliability prediction, material including 3D chip stacking, power electronics, RF HEMT devices, top side
characterization, material modeling and standardization (JEDEC/IPC-9301 cooling, phase change materials, additive manufacturing, MEMS, and
guideline) in the field of microelectronics packaging. thermoelectric modules. More recently, she has initiated a research
program in Advanced Power Electronics Packaging and Thermal
28 Management which focuses on four main challenges of power electronics
packaging: transient thermal mitigation, additive manufacturing,
coengineering/codesign, and high-voltage packaging.
