Page 24 - ASME INTERPACK 2018 Program
P. 24
Panel Sessions
Debbie G. Senesky, Mudasir Ahmad,
Stanford University, Stanford, CA Cisco Systems, Inc., San Jose, CA
Debbie G. Senesky is an Assistant Professor at Stanford University in the Mudasir Ahmad is a Distinguished Engineer/Senior Director at Cisco
Aeronautics and Astronautics Department and by courtesy, the Electrical Systems, Inc. He has been involved with mechanical design,
Engineering Department. In addition, she is the Principal Investigator of microelectronics packaging design and reliability analysis for 17 years. He
the EXtreme Environment Microsystems Laboratory (XLab). Her research received his Bachelors from Ohio University, his M.S. degree in
interests include the development of micro- and nano-scale sensors, Mechanical Engineering from Georgia Institute of Technology and his
high-temperature wide bandgap & 2D electronics, and robust interface Masters in Management Science & Engineering at Stanford University.
materials for operation within extreme harsh environments. In the past, Mudasir is leading the Center of Excellence for Numerical Analysis,
she has held positions at GE Sensing (formerly known as NovaSensor), GE developing new analytical/stochastic algorithms, experimental design and
Global Research Center, and Hewlett Packard. She received the B.S. reliability characterization of next generation 3D packaging, System-in-
degree (2001) in mechanical engineering from the University of Southern Package Modules and Silicon Photonics. Mudasir is also involved with
California. She received the M.S. degree (2004) and Ph.D. degree (2007) implementing IoT, Artificial Intelligence and Big Data Analytics to
in mechanical engineering from the University of California, Berkeley. She streamline Supply Chain Operations. Mudasir has delivered several invited
has served on the program committee of the IEEE International Electron talks on leading technology solutions internationally.
Devices Meeting (IEDM), International Conference on Solid-State Sensors,
Actuators and Microsystems (Transducers), and International Symposium Outside of Cisco, he is involved with programs at the Silicon Valley
on Sensor Science (I3S). She is currently co-editor for IEEE Electron Chapter of the Components Packaging and Manufacturing Technology
Device Letters, Sensors ( journal), and Micromachines ( journal). She is a (CPMT) Society of the IEEE, and actively participates in IPC and JEDEC
recipient of the NASA Early Faculty Career Award and Alfred Sloan standards organizations. He was actively involved in the local CPMT
Foundation Fellowship Award. More information about Prof. Senesky can chapter of IEEE for several years; holding the positions of Secretary, Vice
be found at xlab.stanford.edu or on Instagram: @debbiesenesky. Chair and Chair of the Chapter. Mudasir has over 30 publications on
microelectronic packaging, two book chapters, and 13 US Patents. He
Przemyslaw Gromala, received the internationally renowned Outstanding Young Engineer
Robert Bosch GmbH, Reutlingen, Germany Award in 2012 from the IEEE.
Dr. Przemyslaw Gromala is a simulation senior expert at Robert Bosch Rajen Dias,
GmbH, Automotive Electronics in Reutlingen. Currently leading an Amkor Technology, Tempe, AZ
international simulation team and FEM validation lab with the main focus
on implementation of simulation driven design for electronic control Dr. Rajen Dias is a Director of Advanced Products Development at Amkor
modules and multi-chip power packaging for hybrid drives. His research Technology, USA responsible for developing and qualifying advanced
activities focus on virtual pre-qualification techniques for development of packaging solutions such as 2.5D TSV technologies and large body
the electronic control modules and multi-chip power packaging. His FCBGA. Prior to Amkor, he was Principal Engineer at Intel’s Assembly
technical expertise includes material characterization and modeling, Technology Development Quality & Reliability Group focusing on reliability
multi-domain and multi-scale simulation including fracture mechanics, and failure analysis of package pathfinding programs for computer, server
verification techniques and prognostics and health management for future and FPGA applications for 32 years. He did his undergraduate B.Tech. at
safety related electronic smart systems. Prior to joining Bosch, Dr. Gromala Indian Institute of Technology, Madras, India and graduated with a MS and
worked at the Delphi Development Center in Krakow, as well as at the Ph.D in Materials Science from Lehigh University, Bethlehem, USA. He is
Infineon Research and Development Center in Dresden. He holds a PhD in past General Chair of the Electronic Components and Technology
mechanical engineering from Cracow University of Technology in Poland. Conference (ECTC), published over 45 technical publications in packaging
and has 32 patents.
24
