Page 116 - ASME InterPACK 2017 Program

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The SiP Company

Innovative IC, SiP, and MEMS packaging
portfolio to serve dynamic mobility,
IoT, high performance computing,
and automotive markets.

PoP • Flip Chip • SiP • WLP • Fanout • FOCoS
2.5D • TSV • Flex • AoP • AiP • Shielding

Wire Bond • Embedded • Substrate • Co-Design

Package it.  aseglobal.com

116  @asegroup_global