Page 121 - ASME InterPACK 2017 Program
P. 121
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www.asme.org/events/joint-rail-conference 121PERFORMANCEAPPLICATIONS
• Spatial resolution: 290 nm • Detect thermal hot spots
• Temporal resolution: 800 ps • Failure & reliability analysis
• Monitor process variations
• Thermal resolution: 0.1 °C • Time-varying thermal behavior
• Validate thermal models
• Full field thermal images
• Pixel by pixel calibration
