Page 3 - ASME InterPACK 2017 Program

Chairs’ Welcome Message Dr. Mehdi Asheghi
General Conference Chair
On behalf of the ASME Electronic and Photonic Packaging Division (EPPD), we welcome you Stanford University
with great pleasure to the 2017 International Technical Conference and Exhibition on
Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) at the Hilton Dr. Ravi V. Mahajan
San Francisco Financial District, San Francisco, CA, August 29 - September 1, 2017. Conference Co-Chair
Intel
InterPACK is the premier international forum for exchange of state-of-the-art knowledge in
research, development, manufacturing, and applications of Micro-electronics Packaging, Dr. Kaustubh Nagarkar
MEMS, and NEMS. It is the flagship conference of the ASME Electronic and Photonic Technical Program Chair
Packaging Division (EPPD). The InterPACK Conference Series was founded in 1992 as the GE Ventures
ASME-JSME Joint Electronic Packaging Conference and was renamed InterPACK in 1995. In
recognition of and in response to a rapidly changing landscape and in order to maintain a Dr. Samuel Graham
competitive edge and leadership, the InterPACK Advisory Committee (IAC) and EPPD Technical Program Co-Chair
Executive Committee decided in 2015 that InterPACK will be held annually starting 2017. The Georgia Tech
InterPACK Pathfinding workshop (IPW) was held in June 2016, Silicon Valley, CA, USA, to get
broad feedback across industry and academia on the best ways of redefining and refocusing 3
the conference to comprehensively address the pressing issues facing the InterPACK
community.

As a result, the scope of InterPACK2017 has been significantly enhanced to include some of
the most cutting edge topics in Electronics Packaging, Device Integration, and Reliability.
InterPACK2017 will be a systems focused conference covering topics on Heterogeneous
Integration: Micro-Systems with Diverse Functionality, Servers of the Future, Structural and
Physical Health Monitoring, Energy Conversion & Storage and finally, Transportation:
Autonomous & Electric Vehicles. InterPACK2017 aims at delivering tangible value to industry
through cutting edge “Hot off the Press” research results presented in nearly 50 keynotes
and invitation-only presentations by thought leaders from industry, national labs, academia
scientists, engineers and scholars. In addition, InterPACK 2017 features nearly 100 technical
papers and 100 technical presentations. InterPACK2017 provides unprecedented technical
and HR access to students through industry funded poster sessions as well as in-conference
student training for industry & academia assimilation. InterPACK2017 aims at delivering
tangible value to academia by providing access and exposure to industry visionaries through
keynotes and “Debate Style” Panels, funding agency leaders, lead research consortia,
Start-ups, vendors/exhibitors.

We would like to acknowledge and extend our special gratitude to all of the volunteers
whose dedication and hard work have made this conference possible. These volunteers
include track, topic and session chairs, the Plenary Speaker; track Keynote speakers, Panel
Moderators and Panelists; Workshop organizers; Invited “Tech Talk” Speakers; Technical
Paper Authors and Co-Authors; “Technical Presentation” Speakers; and, finally, all the
technical reviewers whose contributions continue to ensure a high level of quality for the
conference. We would also like to thank Stacey Cooper (ASME Publishing) for her dedication
in managing the ASME conference webtool. Last and certainly not the least, our sincere
thanks go to Mary Jakubowski from ASME who has diligently served as the Conference
Administrative Chair, and has capably and efficiently coordinated all the activities related to
conference management and logistics.

We are very excited to have you at InterPACK2017 and encourage you to enjoy the wide
variety of technical venues and opportunities to engage with colleagues and friends.

With our very best wishes to the conference attendees!