Page 8 - ASME InterPACK 2017 Program

Exhibitors and Sponsors

IT IS WITH GREAT APPRECIATION THAT WE ACKNOWLEDGE THIS YEAR’S SPONSORS AND EXHIBITORS!
THEIR SUPPORT, GENEROSITY AND COLLABORATION ALLOWS THIS CONFERENCE TO MAINTAIN ITS
HIGH STANDARDS OF EXCELLENCE.

INTEL Intel makes possible the most amazing experiences of the future. You
may know us for our processors. But we do so much more. Intel invents
For more information at the boundaries of technology to make amazing experiences possible
please visit our website: for business and society, and for every person on Earth.

www.intel.com Harnessing the capability of the cloud, the ubiquity of the Internet of
Things, the latest advances in memory and programmable solutions, and
ASE GLOBAL the promise of always-on 5G connectivity, Intel is disrupting industries
and solving global challenges. Leading on policy, diversity, inclusion,
For more information education and sustainability, we create value for our stockholders,
please visit our website: customers, and society.

www.aseglobal.com Alongside a broad portfolio of established technologies, ASE is also
delivering innovative advanced packaging and System-in-Package
solutions to meet growth momentum across a broad range of end markets.

For more about our advances in SiP, WLP, Fan Out, MEMS, Flip Chip, and,
2.5D, 3D & TSV technologies, all ultimately geared towards applications to
improve lifestyle and efficiency, please visit www.aseglobal.com

GOLD SPONSORS GE VENTURES GE Ventures identifies and accelerates ideas that will help improve the
world. Focused on software, advanced manufacturing, energy and
For more information healthcare, GE Ventures combines investing, new business creation,
please visit our website: licensing, thought leadership, early market development and more to
deliver an innovation platform designed to drive growth with our partners.
www.geventures.com

S3IP The S3IP, comprising five constituent research centers and two
laboratories (available for industry use), brings to bear faculty expertise,
For more information applied and fundamental academic research results and capability in
please visit our website: electronics packaging. Its staff has decades of industrial experience to
www.binghamton.edu/s3ip/ solve practical problems for electronics industry partners. An industrial
member-driven research portfolio and project base in thermal
DAEDUCK management, manufacturing materials, failure analysis, reliability
improvement, and energy efficiency for electronic systems underpins
For more information improvements in the manufacturing of microelectronic products,
please visit our website: commercialization of flexible printed electronic technology, development
www.daeduck.com/eng/ of advanced batteries and energy harvesting devices, and improvements
in the energy efficiency of data centers.

DAEDUCK Electronics is a PCB manufacturer based in South Korea.
Throughout the history of 50 years, DAEDUCK Electronics has grown
along with the electronics industry of Korea, and is now one of the top 10
leading PCB manufacturers in the world, as reported by Prismark.
DAEDUCK’s PCB products ranges from Automotive PCB to Multi-Layer
Board and Package Substrates. With our company philosophy, DAEDUCK
engineers are driven by customer’s needs, leading technology and
product quality to contribute not only to our customers but also to our
community.

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