Page 10 - ASME InterPACK 2017 Program

Plenary Luncheon Keynote

WEDNESDAY, AUGUST 30, 2017 12:30 pm – 2:00 pm
Room: Grand Ballroom, Third Floor

Michael Liehr “Challenges to Integrated Photonics Manufacturing”
CEO
AIM Photonics Biography
Michael Liehr is the Chief Executive Officer of the American Institute for Manufacturing (AIM) of
10 Integrated Photonics and the SUNY Poly Executive Vice President for Technology and Innovation.
Michael focuses on the creation of new semiconductor and related industries business opportuni-
ties, and is responsible for the effective and efficient operation of the SUNY Poly industrial
programs including SUNY Polytechnic Institute’s strategic 300mm advanced CMOS line,
integrated photonic semiconductor and 3D packaging and the 150mm SiC power electronics. He
is also SUNY Poly’s Vice President for Research. Prior to this assignment, he led the Global
450mm Consortium through the start-up phase as the General Manager and was an IBM
Distinguished Engineer.

Abstract
The American Institute for Manufacturing Photonics (AIM Photonics), a member of Manufacturing
USA, is a manufacturing consortium headquartered in NY to advance the state of the art in the
design, manufacture, testing, assembly, and packaging of integrated photonic devices. The scope
of AIM Photonics spans several industry segments, with the most prominent and near term
commercial segment of Datacom applications, to analog/RF, array and sensor applications that are
expected to mature in the next few years. Photonic Integrated Circuits (PIC) technology enables
optical systems to be miniaturized and fabricated on semiconductor chips. Just as electronic
integrated circuits revolutionized electronics by miniaturizing transistor circuitry, PICs integrate
lasers and other optical devices to route and process information with reduced size and power.
PICs can also scale in complexity to do things that would not be possible using conventional
optical design approaches. By putting these components on a single platform, PICs have the
potential to advance technology in ways never before possible.
Targeted markets include:

• New high-performance information-processing systems and computing
• Compact biomedical sensor applications
• Urban navigation, free space optical communications, and quantum information sciences
• Other military applications, including electronic warfare, analog RF sensing, communica-

tions, and chemical/biological detection

In the first two years of operation, the institute has focused most of its resource to develop an
infrastructure in electronic-photonic design automation, a multi project wafer offering, as well as
test, assembly and packaging. These efforts are focused on the support of larger companies,
SMEs, universities and federal agency needs. The industry paradigm shifts create a number of
design, packaging, and assembly challenges that must be addressed before PIC technology
can make its way into broad-based commercialization and volume manufacturing. AIM Photon-
ics believes its collaborative approach will put in place an end-to-end photonics “ecosystem”
that includes domestic foundry access, integrated design tools, automated packaging, assembly
and testing, and workforce development, plus create a standardized platform to make it easier
to scale the technology across multiple markets for companies of all sizes.

AIM Photonics uses the extensive 300 mm state-of-the-art equipment set in SUNY Poly Albany
and welcomes customers to access the capabilities in a variety of access models, including a
Multi-Project-Wafer (MPW) low-cost-of-entry program, customized and IP protected develop-
ment, or early production support for limited volumes with or without ITAR protection and ISO
certification. Photonic elements have been demonstrated repeatedly to operate at 50GHz. 3D
and 2.5D assembly is supported in Albany at full wafer scale. AIM is currently outfitting a Test,
Assembly, and Packaging operation in Rochester with an expected opening date in 3Q2017.
The facility will enable full photonic packaging with laser and fiber attach, and at speed testing
capabilities.