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Track Keynotes

TRACK 2: SERVERS OF THE FUTURE

WEDNESDAY, AUGUST 30, 2017 9:15 am – 10:15 am
Room: Jackson, Second Floor

Session 7-2-1 - A Systems Perspective; Making Thermal Management a First Class Citizen Dr. Michael K.
Patterson
Biography
Dr. Michael K Patterson is a Senior Principal Engineer on the Advanced Development team of Senior Principal
the Data Center Group at the Intel Corporation, in Hillsboro, Oregon. His current focus is in the Engineer
power, thermal, and energy-efficient-performance areas of High Performance Computing. The
work covers silicon level activity, through platform and rack-level solutions, and on up to Intel Corporation
interface with Data Center power and cooling technologies. He did his undergraduate work at
Purdue University, received his MS degree in Management from Rensselaer Polytechnic
Institute, and was awarded his MS and PhD in Mechanical Engineering from the University of
Vermont. His current technical interests include super-computer architecture, server power and
thermal management technologies, and high density data center concepts. He has been with
Intel for 23 years. He is a registered Professional Engineer. He is a Fellow of the ASME. He is a
member of ASHRAE, and served as the Research Chair for ASHRAE TC9.9, Mission Critical
Facilities. He also represents Intel in a number of Green Grid Activities, most notably as the first
chair of the Data Center Technology and Strategy Working Group. Dr. Patterson has been
certified by the US DOE as a DCEP. He is also on the leadership team of the EE HPC WG,
currently serving as the Workshop and Conferences Co-Chair.

Abstract
Thermal management is very often left to the final stages of the design work. This is true of the
component, the package, and the product. The electronics design is completed based upon the
expected performance goals and then the thermal engineers are asked to cool it. This all too
often leads to sub-optimum designs, with cost, performance, and efficiency implications.
Drawing on High Performance Computing (HPC) experiences, the impact of viewing thermal
management from the system perspective is explored. Conclusions are drawn about how this
view can cause the thermal aspects to move into the mainstream of the design process instead
of being an afterthought. The issues are explored at all levels of the problem, from the compo-
nent, to the IT equipment, up through and including the data center with positive results
available at each step. Taking a system perspective can move thermal management into the
heart of the design process where we can ultimately provide the best value to the end-user.

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