Page 14 - ASME InterPACK 2017 Program

Track Keynotes

TRACK 3: STRUCTURAL AND PHYSICAL HEALTH
MONITORING

WEDNESDAY, AUGUST 30, 2017 11:00 am – 12:00 pm
Room: Jackson, Second Floor

Jason Marsh Session 7-3-1 - Flexible Future: How FHE Changes the Shape of Medical, Structural Health,
NextFlex Asset Monitoring and Soft Robotics Applications

Biography
Jason Marsh has worked in operations and engineering roles for Kyocera in the US, Japan,
India, Germany, Mexico and China. As a materials science and automation engineer with a
background in machine vision and industrial automation and equipment, Jason has worked on a
variety of technologies from satellite applications, 3D Printing of metals and ceramics, produc-
tion automation as well as advanced microelectronics and control systems. He has served on
advisory boards and consulted for companies in a wide range of industries from artificial
intelligence to outdoor equipment to solar power to agriculture. He is passionate about
advancing electronics towards a future where function follows form and our electronics
integrate into our lives seamlessly improving healthcare, infrastructure safety and reducing
waste in applications like food, agriculture and industrial supply chains.

Abstract
After an introduction to NextFlex, America’s Flexible Hybrid Manufacturing Institute, and
Flexible Hybrid Electronics (FHE), the speaker will identify current and emerging applications for
FHE, including key target markets and the challenges that FHE can solve in healthcare,
infrastructure and transportation safety, agricultural IOT, and even science fiction-worthy
products such as wearable exoskeleton suits. The speaker will outline key attributes of the FHE
form factor and manufacturing methods best suited for these applications, as well as critical
areas of process and technology development that are currently underway to enable the next
generation of these products to go to market. Lastly the speaker will focus on FHE manufactur-
ing technologies in advanced packaging including additive conductors, flexible test methods,
thin die handling, and several others.

14