Page 11 - ASME InterPACK 2017 Program

Awards Luncheon

INTERPACK 2017 ACHIEVEMENT AWARDS LUNCHEON

THURSDAY, AUGUST 31, 2017 12:30 pm – 2:00 pm
Room: Grand Ballroom, Third Floor

MetaMaterials for Thermal Management Kenneth E. Goodson
Davies Family
Biography Provostial
Ken Goodson chairs the Mechanical Engineering Department and holds the Davies Family Professor
Provostial Professorship at Stanford University. He is a heat transfer researcher, specializing in Bosch Department
electronics cooling at multiple scales from nano conduction to microfluidic heat sinks. His lab has Chairman
graduated 40 PhDs, nearly half of whom are professors at schools including MIT, Stanford, and UC Stanford Mechanical
Berkeley. Honors include the Kraus Medal, the Heat Transfer Memorial Award, the AIChE Kern Engineering
Award, and Fellow grade with ASME, IEEE, APS, and AAAS. Goodson received the PhD from MIT nanoheat.stanford.edu
and co-founded Cooligy, which built microfluidic cooling systems for the Apple G5 and was
acquired by Emerson in 2006. At Stanford, serving as Mechanical Engineering Chair and Vice 11
Chair since 2008, Goodson led two strategic plans and launched hiring actions for 15 new faculty
who are transforming the department’s scholarship and diversity.

Abstract
Thermal management is critical for electronic systems ranging from servers and smartphones to
radar HEMTs and hybrid vehicle converters. Great research progress is being achieved through
thermal metamaterials, which offer unusual combinations of thermal, mechanical, fluidic, and other
properties by means of micro- or nanoscale heterogeneity, porosity, and/or layering. This talk
summarizes our efforts in this area with an emphasis on interface-dominated heat conduction and
fluid transport physics, and highlights needs and opportunities for more research. One example is
thermal switches for heat routing and transient temperature control. Recently we demonstrated
9:1 reversible thermal resistance ratios using Li intercalation in MoS2 multilayers. Another
example is template-fabricated copper inverse opals which, when conformally coated into
laser-etched diamond microchannels, facilitate very large heat fluxes for microfluidic two-phase
heat sinks. These inverse opals can also encapsulate phase change materials, promising high
effective heat capacity and thermal conductivity. This talk will highlight collaborations with the
semiconductor industry, US defense companies and the NSF center on power electronics
(POETS).

PAPER AND POSTER AWARDS

FRIDAY, SEPTEMBER 1, 2017 12:30 pm – 2:30 pm
Room: Grand Ballroom, Third Floor

The Awards Luncheon will provide a forum to acknowledge the contributions of the InterPACK’17
organizing committee members, authors, presenters, volunteers and ASME staff. Important
amongst this time of recognition will be the introduction of the InterPACK’17 Best and Outstanding
Papers and Poster Awards. Starting from 2017, the Annual ASME EPPD Awards will be presented
at the ASME InterPACK Awards Luncheon. These prestigious awards span the following catego-
ries: Excellence in Mechanics Award, Woman Engineer of the Year Award, Young Engineer of the
Year Award, and Student of the Year Award. This year, we will also honor the recipients of the
ASME Journal of Electronic Packaging (JEP) Awards that includes 2017 Best Paper, Associate
Editor, Associate Editor Service Award, Reviewer of the Year Award.