Page 9 - ASME InterPACK 2017 Program
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Exhibitors and Sponsors
Please be sure to visit our exhibitors in the Second Floor Foyer, located in the second floor of the hotel during these hours:
Wednesday, August 30, 2017 8:30am – 11:15am | 3:30pm – 6:15pm
Thursday, August 31, 2017 8:30am – 11:15am | 3:30pm – 7:30pm
Friday, September 1, 2017 10:30am – 11:30am
Microsanj is a leading provider of high-resolution transient thermal imaging MICROSANJ SILVER SPONSORS
solutions & services for commercial and research applications. The systems
are based on optical thermoreflectance characterization, digital signal For more information
processing, and advanced software algorithms to support: electronic and please visit our website:
optoelectronic components measurement, thermal design validation of ICs, www.microsanj.com
defects, and failure analysis.
SILNTHDDIN.UKSOTREIELESCCTOR.I,C
SHINKO Electric Industries Co., LTD., is a leading manufacturer of
semiconductor and microelectronic packaging products including Organic For more information
Laminate Build-up Substrates, Etched and Stamped Lead Frames, please visit our website:
Integrated Heat Spreaders, and IC and Module Assembly. We manufacture www.shinko.com
a full line of Organic Substrate structures including coreless options
offering enhanced electrical performance and package miniaturization. PWUOBRLLIDSHSICNIGENTIFIC
SHINKO also provides subcontract IC assembly services with an emphasis
on packaging solutions such as PoP, SiP and Molded Core Embedded For more information
Package (MCeP®) as well as Module assembly and test in support of a wide please visit our website:
range of markets. From mobile to industrial and automotive, SHINKO www.worldscientific.com
provides high yielding, quality packages designed to exceed the
requirements for each application.
Founded in Nagano, Japan in 1946, SHINKO’s headquarters and primary
production plants continue to reside in the greater area. In addition to our
production facilities, we also provide the ultimate in service and solutions
for our customers with Sales and Engineering support Worldwide. Come
visit us at our booth to learn more about our latest product offerings for fine
pitch interconnection, miniaturization and high density die mounting.
World Scientific Publishing is a leading independent publisher of books
and journals for the scholarly, research and professional communities. The
company publishes about 600 books annually and about 130 journals in
various fields. World Scientific collaborates with prestigious organisations
like the Nobel Foundation, US National Academies Press to bring high
quality academic and professional content to researchers and academics
worldwide.
HENKEL ADHESIVE ELECTRONICS (AE) EXHIBITORS
Henkel Adhesive Electronics (AE) is a division of global materials innovator, Henkel Corporation. Headquartered in
Irvine, California with sales, service, manufacturing and advanced R&D centers around the globe, Henkel AE is
focused on developing next-generation materials for a variety of applications in the automotive market sectors.
Henkel manufactures the leading industry brands of LOCTITE, TECHNOMELT and BERGQUIST with a broad portfolio
of materials including printed electronic inks, thermal interface materials and thermal insulated substrates,
electrically conductive adhesives and low pressure molding. With over 90 years of innovation, Henkel AE provides
solutions to improve efficiency for power generation, conversion and storage in new energy vehicle electronics.
For more information please visit our website: www.henkel-adhesives.com/electronics
STÄUBLI
Stäubli is an innovative mechatronics solutions provider with three dedicated activities: Connectors,
Robotics and Textile. With a workforce of over 4500, Stäubli has a presence in 25 countries and agents in
50 countries around the world.
For more information please visit our website: www.staubli.us
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GE VENTURES – TABLE 1 | SHINKO – TABLE 2 | S3IP – TABLE 3 | HENKEL – TABLE 4 | MICROSANJ – TABLE 5
STABULI – BOOTH 1 | ASE GROUP – BOOTH 2
