Page 3 - ASME AM3D/IDETC/CIE 2015 Program
P. 3
IDETC/CIE 2015 CHAIRS’ WELCOME IDETC/CIE
We are pleased to welcome everyone to the 2015 ASME International Design and international committees, symposium organizers,
Engineering Technical Conferences and Computers and Information in authors, and reviewers. We would like to warmly thank all
Engineering (IDETC/CIE) Conference in Boston, MA, USA, August 2-5, 2015. of these members of our community for making IDETC/
This fl agship international meeting, for the ASME Design Engineering Division CIE 2015 and AM3D a landmark in terms of submitted
and the Computers and Information in Engineering Division, consists of the papers and technical program. We would also like to
following fourteen conferences: express our appreciation for the efforts of the ASME
staff, whose hard work behind the scenes is incredibly
• 17th International Conference on Advanced Vehicle Technologies (AVT)
valuable.
• 8th Frontiers in Biomedical Devices (BIOMED)
We are proud to welcome you to a rich social program
• 35th Computers and Information in Engineering Conference (CIE) which features as the key event a reception at the John F.
Kennedy Presidential Library & Museum with self-guid-
• 41st Design Automation Conference (DAC)
ed tours of the Main Exhibit Galleries and the Special
• 12th International Conference on Design Education (DEC) Exhibit Gallery and a technical tour of the Massachusetts
Institute of Technology.
• 20th Design for Manufacturing and the Life Cycle Conference (DFMLC)
We hope you will enjoy the IDETC/CIE 2015 and AM3D
• 27th International Conference on Design Theory and Methodology (DTM)
conferences and feel at home in the vibrant atmosphere
• 2015 ASME/IEEE International Conference on Mechatronic and Embedded of Boston.
Systems and Applications (MESA)
• 39th Mechanisms and Robotics Conference (MR) Walter Lacarbonara
• 9th International Conference on Micro- and Nanosystems (MNS) Conference co-Chair
• 11th International Conference on Multibody Systems, Nonlinear Dynamics, and Sapienza University of Rome
Control (MSNDC)
• ASME 2015 Power Transmission and Gearing Conference (PTG)
• 23rd Reliability, Stress Analysis, and Failure Prevention Conference (RASFP) Jeffrey F. Rhoads
• 27th Conference on Mechanical Vibration and Noise (VIB) Conference co-Chair
Purdue University
This year, IDETC/CIE 2015 will co-locate with the new 2015 ASME Additive
Manufacturing + 3D Printing (AM3D) Conference to highlight emergent
technologies that impact the critical engineering issues of product design and Tamas Kalmar-Nagy
development, manufacturing, and the management and integration of informa-
tion systems throughout the product life-cycle. Program Chair
Presentations of papers across a very wide range of sessions are complement- Budapest University of Technology and
ed by inspiring plenary and keynote lectures, lively panel discussions, and Economics
informational tutorials and workshops encompassing a rich spectrum of
cutting-edge topics related to engineering design and manufacturing, theoreti-
cal and experimental paradigms for nano- to macro-scale applications, as well
as the use of computers in engineering. IDETC/CIE 2015 and AM3D will
hopefully serve not only as a unique forum for the sharing of recent research
results and industrial fi ndings, but also as a superb forum for networking within
and between academia, government, funding bodies and industry.
Of the 1,336 draft papers originally submitted to the conference, 1,091 have
been included in the fi nal technical program.
A successful technical program depends on several dedicated conference
chairs, program chairs, technical committee chairs, and members of advisory
3
We are pleased to welcome everyone to the 2015 ASME International Design and international committees, symposium organizers,
Engineering Technical Conferences and Computers and Information in authors, and reviewers. We would like to warmly thank all
Engineering (IDETC/CIE) Conference in Boston, MA, USA, August 2-5, 2015. of these members of our community for making IDETC/
This fl agship international meeting, for the ASME Design Engineering Division CIE 2015 and AM3D a landmark in terms of submitted
and the Computers and Information in Engineering Division, consists of the papers and technical program. We would also like to
following fourteen conferences: express our appreciation for the efforts of the ASME
staff, whose hard work behind the scenes is incredibly
• 17th International Conference on Advanced Vehicle Technologies (AVT)
valuable.
• 8th Frontiers in Biomedical Devices (BIOMED)
We are proud to welcome you to a rich social program
• 35th Computers and Information in Engineering Conference (CIE) which features as the key event a reception at the John F.
Kennedy Presidential Library & Museum with self-guid-
• 41st Design Automation Conference (DAC)
ed tours of the Main Exhibit Galleries and the Special
• 12th International Conference on Design Education (DEC) Exhibit Gallery and a technical tour of the Massachusetts
Institute of Technology.
• 20th Design for Manufacturing and the Life Cycle Conference (DFMLC)
We hope you will enjoy the IDETC/CIE 2015 and AM3D
• 27th International Conference on Design Theory and Methodology (DTM)
conferences and feel at home in the vibrant atmosphere
• 2015 ASME/IEEE International Conference on Mechatronic and Embedded of Boston.
Systems and Applications (MESA)
• 39th Mechanisms and Robotics Conference (MR) Walter Lacarbonara
• 9th International Conference on Micro- and Nanosystems (MNS) Conference co-Chair
• 11th International Conference on Multibody Systems, Nonlinear Dynamics, and Sapienza University of Rome
Control (MSNDC)
• ASME 2015 Power Transmission and Gearing Conference (PTG)
• 23rd Reliability, Stress Analysis, and Failure Prevention Conference (RASFP) Jeffrey F. Rhoads
• 27th Conference on Mechanical Vibration and Noise (VIB) Conference co-Chair
Purdue University
This year, IDETC/CIE 2015 will co-locate with the new 2015 ASME Additive
Manufacturing + 3D Printing (AM3D) Conference to highlight emergent
technologies that impact the critical engineering issues of product design and Tamas Kalmar-Nagy
development, manufacturing, and the management and integration of informa-
tion systems throughout the product life-cycle. Program Chair
Presentations of papers across a very wide range of sessions are complement- Budapest University of Technology and
ed by inspiring plenary and keynote lectures, lively panel discussions, and Economics
informational tutorials and workshops encompassing a rich spectrum of
cutting-edge topics related to engineering design and manufacturing, theoreti-
cal and experimental paradigms for nano- to macro-scale applications, as well
as the use of computers in engineering. IDETC/CIE 2015 and AM3D will
hopefully serve not only as a unique forum for the sharing of recent research
results and industrial fi ndings, but also as a superb forum for networking within
and between academia, government, funding bodies and industry.
Of the 1,336 draft papers originally submitted to the conference, 1,091 have
been included in the fi nal technical program.
A successful technical program depends on several dedicated conference
chairs, program chairs, technical committee chairs, and members of advisory
3
