Page 15 - ASME IDETCCIE 2017 Program

Welcome Letters

IDETC/CIE

13TH ASME/IEEE INTERNATIONAL CONFERENCE ON MECHATRONIC & EMBEDDED SYSTEMS
& APPLICATIONS (MESA)

The 2017 ASME/IEEE International Conference on Mechatronic and Embedded Systems and Applications (MESA 2017) is sponsored by ASME
Division of Design Engineering and IEEE Intelligent Transportation Systems Society. On behalf of the Organizing Committee, we would like to
extend to you our warmest welcome to the MESA 2017.

MESA was the first and so far the only conference that aims to bring mechatronic and embedded system designs and applications together.
MESA provides a unique opportunity for professionals and students from different fields to meet and exchange ideas and experiences on
research and development in mechatronic and embedded systems. MESA also represents a fruitful collaboration model between ASME and IEEE.
Currently, MESA is organized by ASME and IEEE alternatively each year. Last year edition in August 2016, MESA was held in Auckland, New
Zealand, organized mainly by IEEE.

This year we received 90 initial paper submissions. A majority of the submitted papers were reviewed by three reviewers. Only papers with at
least two positive reviews were accepted. Through a rigorous review process by the Program Committee finally 65 papers are included in the
conference program for presentations in 19 technical sessions. In addition, there is one excellent keynote speech.

The success of MESA 2017 would be impossible without the tireless effort and dedicated work of the Members of the Organizing Committees.
In particular, we would like to express our sincere thanks to Symposium Chairs for their wisdom and hard work in coordinating the review of all
submitted papers. We are grateful for Members of the International Program Committee and reviewers for their thorough review of the papers.

We would like to thank the Members of the Awards Committee for selecting papers for Best Paper Awards and Best Student Paper Awards.
Our appreciation also goes to Members of the Advisory Committee for their guidance and to the keynote and plenary speakers who graciously
agreed to share their vision of future challenges in mechatronic and embedded systems and applications. Above all, special thanks go to all the
authors who have contributed their research works at the conference.

Finally, we sincerely hope you will enjoy the conference and have a great time in Cleveland and in Ohio.

Chair Program Chair
Emanuele Frontoni Tapio Heikklla
Marche Polytechnic University VTT – Technical Research Centre of Finland Ltd.

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