Page 16 - ASME ISPS 2016 Program

IoT Technical Session MONDAY, JUNE 20

KEYNOTE ADDRESS COFFEE NETWORKING BREAK IOT SOFTWARE & CLOUD PLATFORMS
Grand Ballroom BCD 8:00am – 9:15am Grand Ballroom Foyer 11:00am – 11:15am Seattle 2:15pm – 3:45pm

Connecting the World of IoT Secure Authentication for IoT in the Post Rolljam Era
ENGINEERED SYSTEMS
Scott Scheeler, Cisco Systems Sebastien Roy, Sherbrooke University
Grand Ballroom E 11:15am – 12:45pm
For more information see page 11 Using IoT to turn Analytics into Farm Implements

IoT for Aerospace Chandra Krintz, UCSB
SENSING SYSTEMS Richard Alena, NASA Ames Research Center Bridging the IoT Gap: Towards Meaningful Edge Computing
Grand Ballroom E 9:30am – 11:00am
Platforms for High Throughput Molecular Profile Data Generation to Grant Mackey, Western Digital
Enable Precision Medicine
Intelligent and Interactive Devices with Intel® RealSense Technology
Michael Murphy, LSU THERMAL MANAGEMENT OF PACKAGES USED IN AUTOMOTIVE
Achin Bhowmik, Intel ELECTRONICS
Challenges to Connect Hearing Aids to the External World
A MEMS Spectral Sensor for IoT Applications Grand Ballroom E 2:15pm – 3:45pm
Kaysar Rahim, Starkey Hearing Technologies
Bassam Saadany, Si-Ware
Challenges in Automotive System Thermal Design
3D Printing in IoT
IOT APPLICATIONS, CONNECTIVITY, SECURITY & STANDARDS Stephen Langake, Michael Schroeder, Intel
Ahsan Mian, Wright State University Seattle 11:15am – 12:45pm
Challenges of Electronics Cooling in Automotive Applications

M2M and IoT Connectivity Through Cellular Technology Srinivas Damaraju, Nvidia,
THERMAL CHALLENGES IN CONSUMER ELECTRONICS AND
HANDHELD DEVICES Abdallah Shami, Western University Next Generation Thermal Imaging Systems without Borders
Seattle 9:30am – 11:00am
IoT Connectivity, the Wild Wild West Mo Shakouri, Microsanj

Packaging Challenges for Internet of Things and Wearable Devices Paul Heath, Western Digital
Terrance O’Shea, Hewlett Packard Storage Devices’ Security Role in the Data Management Landscape

Flexible Electronics for Wearables and IoT Danny Ybarra, Western Digital

Jim Huang, Hewlett Packard Enterprise
Thermal Management of Handheld Devices KEYNOTE ADDRESS
Grand Ballroom BCD 12:45pm – 2:15pm
Darryl Moore, Electronics Cooling Solutions

Three Tiers of IoT: Device Services + Edge Services + Cloud Services
Steven Campbell, Western Digital

For more information see page 11

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