Page 21 - ASME ISPS 2016 Program
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MONDAY, JUNE 20 IPW Technical Sessions
KEYNOTE ADDRESS KEYNOTE ADDRESS
2016 IPW Grand Ballroom BCD 8:00am – 9:15am Grand Ballroom BCD 12:45pm – 2:15pm
Connecting the World of IoT Three Tiers of IoT: Device Services + Edge Services + Cloud Services
InterPACK Workshop
Scott Scheeler, Cisco Systems Steven Campbell, Western Digital
For more information see page 11 For more information see page 11
INTERPACK WORKSHOP OPENING REMARKS IOT PACKAGING - EDGE COMPUTING
Santa Barbara 9:20am – 9:30am Santa Barbara 2:15pm – 3:45pm
Santa Clara Marriott , Santa Clara, CA
Ravi Mahajan, Intel Abhijit Limaye, Allomind
Abhijit Dasgupta, University of Maryland Babak Jamshidi, STATS ChipPAC
Eric Pop, Standford
RESEARCH CENTERS STRATEGIC ROADMAPS
Santa Barbara 9:30am – 11:00am
COFFEE NETWORKING BREAK
Abhijit Dasgupta, University of Maryland
Grand Ballroom Foyer 3:45pm – 4:00pm
Rao Tummala, Georgia Tech
Timothy Fisher, Purdue PANEL: SEMICONDUCTOR MANUFACTURING; HOW WILL PACKAGING
INFRASTRUCTURE EVOLVE OVER THE NEXT 10 YEARS?
Grand Ballroom BCD 4:00pm – 6:00pm
COFFEE NETWORKING BREAK
Moderator: Dan Hutcheson, CEO, VSLI Research
Grand Ballroom Foyer 11:00am – 11:15am
Gaurang Choksi, Intel
Bahgat Sammakia, SUNY Binghampton
HETEROGENOUS INTEGRATION
Santa Barbara 11:15am – 12:45pm Bryan Black, AMD
John Xie, Intel / Altera
Subramanian Iyer, UCLA
Jason Marsh, NextFlex
Jason Marsh, NextFlex
Suresh Ramalingam, Xilinx
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ISPS/IOT/IPW Program-june16r4.indd 21 6/9/16 2:08 PM
