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MULTILAYER CERAMIC CAPACITORS

Y5V 外觀無明顯破損，容值變化 Force
在±30%之內
No remarkable visual damage Pressuring Rod →
Cp change within ±30%
Testing Substrate
↘

5mm Capacitor

↗
Testing Stand 90±4mm

8.4 焊錫性測試 (Solderability)

電介質(Dielectrics) 判定標準(Specification) 測試條件(Testing Conditions)
NPO 爬錫面積≧95%和孔洞<5% 焊錫溫度(Solder temperature): 250±10℃;
X7R/X5R (95%min. coverage of both terminal 浸泡時間(Dipping time): 2±1 seconds.
X6S/X7T electrodes and less than 5% have pin 焊接劑成份(Solder): Sn=99.7%，Cu=0.3%.
X7S/Y5V holes or rough spots)。 預熱(Preheating): 80~120℃ 10~30sec
將晶片兩端電極完全浸泡於錫爐中(Completely
soak both terminal electrodes in solder)
(相關標準(Related STD.): JIS C 5101-1998 / JIS C
5102 clause 8.4)
8.5 抗焊熱震 (Resistance to Soldering Heat, RSH)

電介質 判定標準(Specification) 測試條件(Testing Condition)
(Dielectrics)
NPO 外觀無明顯破損，容值變化在±2.5%或 ±0.25pF 之 焊錫溫度︰330±10℃
內，以較大者為準，Cp<30pF, Solder temperature: 330±10℃
Q≧400+20Cp; Cp≧30pF, Q≧1000，電阻測試 浸泡時間︰10±1 秒
標準與測試前標準相同 Dipping time: 10±1 seconds
(No remarkable visual damage 焊接劑成份︰純錫
Cp change within ±2.5% or ±0.25pF whichever is larger: Solder: S n= ~100
Cp<30pF, 在室溫中 Class1 需靜置 24±2Hrs,
Q≧400+20Cp; Cp≧30pF, Q≧1000 Class 2,3 需靜置 48±4Hrs，待電性回
IR meet initial standard value) 覆之後再在標準條件下測電性
X7R/X5R 外觀無明顯破損，容值變化在±7.5%之內，散逸因 Measurement to be made after being
X6S/X7T 素和電阻測試標準與測試前標準相同(No kept at room temperature for 24±2
/X7S remarkable visual damage (Class1) or 48±4(Class 2,3) hours.
Cp change within ±7.5% Recovery for the following period under
DF (Tanδ)meet initial standard value the standard condition after test.
IR meet initial standard value) 0805Y / 0805B XX6(含)規格以上，
Y5V 外觀無明顯破損，容值變化在±20%之內，散逸因 1206 / 0612 / 1210 / 1812 所有規格，預
素和電阻測試標準與測試前標準相同(No 熱 150℃，2 分鐘後立即置入錫爐，
remarkable visual damage 中間不得停頓。
Cp change within ±20% (相關標準(Related STD.): JIS C
DF (Tanδ)meet initial standard value 5101-10-1999 / JIS C 6429)
IR meet initial standard value)

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(2016/08/10 revised)