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MULTILAYER CERAMIC CAPACITORS
銲錫量過多 Excessive solder
銲錫適量 Appropriate amount of solder
銲錫量過少 Too little solder
點膠黏著 Adhesive
溫度 熱烘式 回焊爐 焊錫條件(建議)
Temperature (℃) Vapor Re-flow Soldering Condition
250
220~250℃(Max 270℃)
200 Soldering
Pre-Heating keeping at room
150 temp.
100
50
0
2~3 minutes 10~20 sec. More than 2 minutes
說明:晶片電容耐熱能力:MLCC heat resistance capability
1、瞬間溫度 330℃ 10s Peak temperature 330℃ 10s
2、環境溫度維持~217℃ 120s Reflow Temp endurance ~217℃, 120 sec
3、環境溫度維持~225℃ 90s Reflow Temp endurance~225℃, 90 sec
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(2016/08/10 revised)