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MULTILAYER CERAMIC CAPACITORS
溫度 波峰焊爐 焊錫條件(建議)
Temperature (℃) Wave ( Flow ) Soldering Condition
250
220 ~250℃(Max 270℃)
200 Pre-Heating ΔT Soldering
keeping at room
150 temp.
100
50
0
2~3 minutes 5 sec. max. Gradual cooling
(Preheat chips before soldering ΔT; maximum 150℃/T=100℃ )
9.2 自動貼片注意事項 (Consideration for automatic placement)
機器上板子貼片調整(Adjustment of mounting machine)
1. 當電容上 PC 板時不能施加過大的外力於電容上
Excessive impact load should not be imposed on the capacitors when mounting onto the PC boards.
2. 爬錫過程中，支撐物必須恰當並定期檢查確認
The maintenance and inspection of the mountings should be conducted periodically.
不正確的(Not recommended) 正確的(Recommended)
Cracks
單面板爬錫
(Single-sided
Mounting)
Supporting pin ↗
Crack
雙面板爬錫
Double-sided
Mounting
↖ ↑ ↗
Solder peeling cracks Supporting pin
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(2016/08/10 revised)
