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Japanese Journal of Applied Physics
          Vol. 46, No. 10A, 2007, pp. 6489–6497
          #2007 The Japan Society of Applied Physics

          Carrier Recombination Activity and Structural Properties
          of Small-Angle Grain Boundaries in Multicrystalline Silicon

          Jun CHEN and Takashi SEKIGUCHI
          Advanced Electronic Materials Center, National Institute for Materials Science, Tsukuba, Ibaraki 305-0044, Japan
          (Received June 5, 2007; accepted July 17, 2007; published online October 9, 2007)
          The carrier recombination activity and structural properties of small-angle (SA) grain boundaries (GBs) in multicrystalline Si
          (mc-Si) were systematically investigated by electron-beam-induced current (EBIC) and by transmission electron microscopy

          (TEM). At 300 K, SA-GBs with a tilt angle from 0 to 10 generally showed weak EBIC contrast (0–10%) with a maximum


          contrast appearing at 2 , while some special SA-GBs with a tilt angle of 2–3 showed particularly strong contrast (30%). At
          a low temperature (100 K), all the SA-GBs showed strong EBIC contrast despite the tilt angle. Possible explanations for the
          variation of the EBIC contrast are discussed in terms of the interaction and reconstruction of the boundary dislocations. When
          decorated with a metal impurity such as Fe, the SA-GBs showed much stronger EBIC contrast than the large-angle GBs,
          indicating that SA-GBs are effective gettering sites for impurities due to their particular boundary dislocation structures.
          [DOI: 10.1143/JJAP.46.6489]
          KEYWORDS: small-angle, grain boundaries, mc-Si, EBIC


                                                              however, we have found that the recombination activity of
          1.  Introduction                                                                   14)
                                                              some SA-GBs was also weak at 300 K.  Such a difference in
            It is well known that crystallographic defects such as  results probably originated from the difference in the boun-
          dislocations and grain boundaries (GBs) are harmful to the  dary structure or in the contamination level of the impurity.
          performance of semiconductor devices since these defects  The difference in the boundary structure, i.e., SA-GBs
          act as the recombination centers of minority carriers. Early  with different structures may result in different electrical
          reviews on GBs in semiconductors can be found in the  activity. In contrast with the well-reconstructed LA-GBs,
          literature. 1,2)  According to the previous studies, GBs may act  SA-GBs are composed of tilt or twist boundary dislocations
          as carrier recombination centers of shallow or deep levels.  as well as secondary defects. It is also speculated that broken
          The GB character and impurity decoration affect the  bonds may exist at the boundary. The different boundary
          recombination activity of GBs. 3–9)  Studies on the recombi-  defects result in different electrical properties. Thus, to
          nation activity of GBs in semiconductors are prompted by  elucidate the effect of the boundary structure, it is necessary
          the rapid development of multicrystalline silicon (mc-Si) as  to examine different SA-GBs with tilt or twist components
          a promising photovoltaic material.                  within a certain range of misorientation angles. In this study,
            Recently, we have presented new results to contribute  to avoid the extrinsic effect on the recombination activity of
          to the ongoing discussion on the recombination activity of  SA-GBs, high purity mc-Si ingots were used. The recombi-
          GBs in Si. 10,11)  By investigating different GBs in differently  nation activity and structural properties of SA-GBs with a


          Fe-contaminated mc-Si materials using an electron-beam-  misorientation angle of 0 –10 were systematically inves-
          induced current (EBIC), it was found that in clean samples,  tigated as reported in §3.1.
          despite the GB character, the EBIC contrast of large-angle  On the other hand, most SA-GBs found in mc-Si are tilt
          (LA) GBs (including special  and random boundaries)  boundaries. With the development of the direct Si wafer-
          was rather weak at 300 K. This suggests that the intrinsic  bonding technique, artificial boundaries with tilt or twist
          recombination activity of LA-GBs is weak due to the  factors can be fabricated free from metallic contamination.
          boundary reconstruction. However, when decorated with Fe,  The interfaces of directly bonded Si wafers can be regarded
          the room-temperature EBIC contrast of LA-GBs increased  as ideal boundaries. 15,16)  Artificial small-angle boundaries
          with respect to the GB character. Random and high-  fabricated by Si wafer-bonding were also characterized for
          boundaries exhibited stronger EBIC contrast than low-  comparison. The recombination activity and structural
          boundaries. The impurity-gettering ability was in the order  properties of artificial small-angle boundaries are discussed
          of random > high- > low-. In addition, the boundary  in §3.2.
          plane also played an important role in the recombination  The contamination level of the impurity also plays an
          strength of GBs in contaminated mc-Si. For example, among  important role in the electrical properties of GBs. Fe is the
          the 3 boundaries, 3 with {111} boundary planes was less  most frequently found and detrimental impurity in mc-Si.
          electrically active than 3 with other boundary planes. For  Previous studies have found that LA-GBs with an Fe
                                                                                                       3
          LA-GBs, it is clear that LA-GBs with perfect periodicity and  contamination of as low as about 10 13  atoms/cm showed
          without any impurity contamination should be electrically  significant recombination activity at 300 K. 10,17)  For SA-
          inactive.                                           GBs, it is also necessary to investigate the impact of Fe
            In contrast with LA-GBs, the recombination activity of  contamination. By intentionally inducing Fe contamination
          small-angle (SA) GBs has not been systematically inves-  through thermal annealing at different temperatures, the
          tigated. Some researchers have reported that the SA-GBs  impact of Fe on the recombination activity of different
          exhibited high recombination strength at 300 K. 12,13)  Recently  SA-GBs was studied and is reported §3.3. A comparison
                                                              between the recombination activity of SA- and LA-GBs

            E-mail address: CHEN.Jun@nims.go.jp               under different Fe-contamination levels is also given in §3.3.
                                                           6489
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