Page 7 - Aug_Newsletter Draft1

Case Study

We successfully deployed our 3D profilometer into tray-tray IC packing line, we take
advantage of our accurate 3D profilometer and robust detection algorithm to help our
customers maintain high yield. On the tray sample, our customer can predefine measurement
points and planes, and our 3D sensor and library can easily locate those predefine points
based on 2D/3D features, even if there is some displacement between different
measurements.

Function 1: Pre-set point measurement.

With our 3D profilometer, customer can predefine measurement point for their different
product lines.

Function 2: Plane fitting in predefined area

With our 3D profilometer, customer can utilize our extreme fast GPU library to check the
position of each IC.