Page 161 - PCMI Journal July 2018
P. 161
Johan Pellicaan | Sales Manager Central Europe & Technical Manager Dry Film Europe | MacDermid Enthone BV | NL
Dry Film Resist and Total Image
5/29/18
DI FOR 405 NM - PHOTEC DL-3200 SERIES
Specifications
Thickness
Exposure energy *1
Minimum developing time *2
Adhesion *1 (L/S=n/400)
Resolution *1 (L/S=n/n)
Minimum stripping time *3
μm
mJ/cm2
sec
μm
μm
sec
DL-3229
29
15
18
25
25
30
DL-3238
38
16
27
32
30
50
Competitor
30
18
16
27
27
39
DL-3229
DL-3238
Size of striped flake *3 mm 30 30 40
PRIVILEGED AND CONFIDENTIAL MATERIALS
L/S=50/50μm
Resist profile of DL-3200 after developing (Recommended ST， Minimum developing time ×2)
A Platform Specialty Products Company.
*1. Recommended ST, Minimum developing time× 2, DI Machine: DE-1AH by Hitachi Via Mechanics Corporation and surface quality of the base used naterial
*2. 30°C, 1%Na2CO3 developer
*2. 50°C，3%NaOH Stripper (Beaker test)
MACDERMID ENTHONE ELECTRONICS SOLUTIONS
TOTALIMAGE TM
PRIVILEGED AND CONFIDENTIAL MATERIALS
A Platform Specialty Products C m
opany.
Issue 131
July 2018 PCMI Journal 160
10
