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HS-300 P POLYAMID STICK ADHESIVE
Polyamid Based Stick Hot-Melt Adhesive

Art. - Nr. Contents Packaging
200 000 300 205g 1/33

Special properties : Instructions :

• Medium viscosity and medium heat resistance • The surfaces of the workpieces to be bonded
must be dry, and free from dust and grease.
• Good adhesion characteristics to several types of The workpieces must be fit together and
surfaces; Wood, Paper/Carton, Glas, Ceramik, •
Leather, Metal, ABS, PA, PC, PET, PMMA, PS, HIPS, pressed within the skinning time After they have
PUR, HI-PVC etc. been fit together,
• Good bonding strength and weather-proofness • the parts must be fixed and pressed until
functional strength has been reached.
• Good bonding strength at heat
• Can be over-coated with many paint systems
Fields of applications :

• Automotive – Electrical - Packaging
• Product & Wood Assembly
• Telecommunications
• Transportation Filters Gun Application temperature +180˚C - 220˚C
• heat resistant glue stick/ wire fixing/ component Material moisture % 8-10
bonding/ fiber bonding; shoe toe puff adhesive/ Applied quantity 100/350 g/m²
upper vamp bonding adhesive/ lasting adhesive; (depending on material)
hot melt glue stick/ electronic components fixing/ Press time 10 sek
planar and jumper cable fixing/ filling; ealing, Pressure 0.1-1.0 N/mm²
cable, cell phone battery, connector, which has
very good performance at electronic insulation
and humidity and dust resistance;
Technical Data :

Based PAM Polyamid Technical Data
Color yellow / transparent
form ᴓ12/mm² / 200mm MSDS
open time ca 35 sek. (bei +20 °C, 50 % r. F)
Setting time ca 18 sek. Our user instructions, processing guidelines, product-
and performance data, and other technical statements
Viscosity ca 3000 mPa.s bei 190˚C are only general directives; they describe only the
condition of our products (values, determination of
density (20°C/68°F): 1,0 g/cm³ values on the date of completion) and the
Heat resistance -0˚C / +135˚C performances do not represent a warranty.