Page 5 - What's Indiana General been cooking up in memory products

Indiana General is in the stack business in a big way

ln memory planes and stacks, Indiana Gen- dreds of successful Microstack applications.
eral's reputation is a reflection of competent Indiana General has also developed and
and experienced electrical, mechanical and engineered advanced memory frame designs.
technical staffs. We started when data proc- Like molded types, for high density stringing,
essing was just beginning. And we've grown mechanical strength and resistance to acid,
right along with its rapid-paced growth. fungus, moisture and temperature. A plug-
gable, molded plane requires no soldering
between frames. In the field of mass mem-
ory systems, a new "hinged frame" stack has
recently been developed-capacity, over two
I-'tH-!`,I million bits; price, less than one cent per bit.
Core testing, as well as plane and stack
€8,rnnpp,aec`te'#Rc%dos€=E3k!'rd#u°%gge8a,bdyer'Gfhn'8!d`=ontgBg`yheo'vS:#`
testing procedures are stringent. Measure-
ln fact, Indiana General has made many ments of stack parameters over the operating
significant contributions to the state-of-the- temperature range include switching time,
art. Like the Microstack, an lGC innovation. output, peaking time, and amplitudes for
utilizing the folded array mat with contin- binary one and zero. Measurements are
uous wiring, the Microstack has over 80°/o taken on input patterns that include all
fewer solder connections than conventional ones, all zeros, double checkerboard (worst
printed circuit frame-type stacks. The result case noise) and its complement.
is a high density package, with greater reli- No matter how you stack it, you can look
ability and resistance to shock and vibration. to Indiana General for new ideas backed by
The Microstack is available in three dis- years of experience.
tinct packages. The commercial version has
top and bottom printed circuit boards, which
serve to stack individual modules to the de-
sired bit length.
The industrial Microstack utilizes a unique
packing technique which permits individual
modules to be simply plugged together. Bit
length can be increased or decreased in a
matter of minutes. Military versions of the
M icrostack concept can be designed to oper-
ate reliably in extremes of temperature, hu-
midity, altitude, vibration, shock and corro-
sive environments. IGC's experience in pack-
aging techniques has been the key to hun- #tcuT,Set:Ceknstsr°AeEo::reM?jr:!:acmk°::S:rAEgengn:,nmg"';Fbryrat::£¥eAsis1