Page 20 - ASME InterPACK 2017 Program

Technology Talks

TRACK 3: STRUCTURAL AND PHYSICAL HEALTH MONITORING

WEDNESDAY, AUGUST 30, 2017 9:15 am – 10:45 am
Room: Sansome, Second Floor

Janos Veres 8-3-1 - Structural and Physical Health Monitoring

PARC, a Xerox Session Organizer: Prof. Fu-Kuo Chang, Aeronautics & Astronautics, Stanford, CA
Company
Janos Veres leads PARC’s Novel and Printed Electronics Program. He is passionate about the
future of manufacturing and the new ecosystems enabled by digital technologies. His main
interest is exploring 2D and 3D printing and large area processes as manufacturing techniques
for electronic devices. By combining novel materials, device designs and unique deposition pro-
cesses, it becomes possible to print flexible circuits, sensors, memory and hybrid electronic
systems. Janos has held R&D, manufacturing and management positions in material, printing
and electronics companies including PolyPhotonix, Kodak, Merck, Avecia, Zeneca and
Gestetner, where he developed printed circuits, specialty functional materials, OLEDs, displays,
and medical devices as well as printing/coating technologies. Janos holds a Ph.D. in Solid State
Electronics from Imperial College, London.

Digital Fabrication for the IOT

The future Internet of Things (IOT) will require custom solutions to sense and interpret the world.
Tailor made intelligent features are needed that are able to serve thousands of ever-changing,
specialist deployments, increasingly becoming part of the very fabric of the physical world
around us. Printing is a promising approach to tightly integrate and customize sensors and
electronics with devices and objects. Novel printing technologies are beginning to emerge that
enable conformal electronics and even printing with inks containing microchips. This in turn also
creates new openings for the progress of electronics itself. Over the last 50 years silicon
microelectronics advanced through shrinking device dimensions and packing more and more
functionality into tiny spaces. Printing technologies open up exciting new ways of scaling
electronics “Beyond Moore”, through the integration of micro and macro, creating new form
factors, complex shapes, conformal devices and distributed systems. Printed, hybrid electronics
systems will enable new classes of IOT devices; sensor systems, structural electronics and
wearable devices, where the “system is the package”.

Hendrik F. Hamann Dr. Hendrik F. Hamann is a Distinguished Research Staff Member and Research Manager in the
IBM T.J. Watson Physical Sciences Department at the IBM T.J. Watson Research Center, Yorktown Heights, NY.
Research Center He received his PhD from the University of Göttingen. In 1995 he joined JILA (Joint institute
between the University of Colorado and NIST) as a Research Associate in Boulder, Colorado.
20 Since 2001 he is leading the Physical Analytics program in IBM Research. His current research
interest includes the combination of physical model, machine-learning and big data technolo-
gies, internet of things, sensor networks, and sensor-based physical modeling with applications
to renewable energy, precision agriculture etc. He has authored more than 90 peer-reviewed
scientific papers and holds over 90 patents. Dr. Hamann is the winner of the 2016 AIP Prize for
Industrial Applications of Physics, he is an IBM Master Inventor, a member of the IBM Academy
of Technology and has served on governmental committees such as the National Academy of
Sciences, the National Science Foundation and as an industrial advisor to Universities. He is a
member of the American Physical Society (APS), Optical Society of America (OSA), The Institute
of Electrical and Electronics Engineers (IEEE) and the NY Academy of Sciences.