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Technology Talks

TRACK 5: TRANSPORTATION – AUTONOMOUS & ELECTRIC
VEHICLES

WEDNESDAY, AUGUST 30, 2017 7:30 am – 8:30 am
Room: Jackson, Second Floor

8-5-1 - The Changing Landscape of Automotive Electronics Dr. H. Alan
Mantooth
Session Organizer: Dr. Przemyslaw Jakub Gromala, Dr. Ercan M. Dede
University of
The changing landscape of automotive electronics will be presented in two technology talks. Arkansas
Specifically, the impact of future wide bandgap device technology on advanced power
electronics systems will be discussed. Additionally, the fast moving area of automotive startups
will be highlighted. Challenges and future opportunities for technologists and researchers in this
field will be covered.

H. Alan Mantooth received his Ph.D. in electrical engineering from the Georgia Institute of
Technology in 1990. He worked for 8 years in the design automation industry before returning
to the University of Arkansas to join the faculty of the Department of Electrical Engineering
where received is BSEE and MSEE degrees. He currently holds the rank of Distinguished
Professor. His research interests now involve analog and mixed-signal IC design & CAD,
semiconductor device modeling, power electronics, and power electronic packaging. Dr.
Mantooth helped establish the National Center for Reliable Electric Power Transmission
(NCREPT) at the UA in 2005. He serves as the Executive Director for NCREPT as well as two of
its centers of excellence: the NSF I/UCRC on GRid-connected Advanced Power Electronic
Systems (GRAPES) and the Cybersecurity Center on Secure, Evolvable Energy Delivery
Systems (SEEDS) funded by DoE. In 2015, he also helped to establish the NSF Engineering
Research Center entitled Power Optimization for Electro-Thermal Systems (POETS) that focuses
on high power density systems for transportation applications. Dr. Mantooth holds the 21st
Century Research Leadership Chair in Engineering. He currently serves as President of the IEEE
Power Electronics Society. Dr. Mantooth is a Fellow of IEEE, a member of Tau Beta Pi and Eta
Kappa Nu, and registered professional engineer in Arkansas.

High Performance Silicon Carbide Power Packaging—Past Trends, Present Practices, and
Future Directions

A vision for the future of 3D packaging and integration of silicon carbide (SiC) power modules is
presented. Several major achievements and novel architectures in SiC modules from the past
and present have been highlighted. Having considered these advancements, the major
technology barriers preventing SiC power devices from performing to their fullest ability were
identified. 3D wire bondless approaches adopted for enhancing the performance of silicon
power modules were surveyed, and their merits were assessed to serve as a vision for the
future of SiC power packaging. Current efforts pursuing 3D wire bondless SiC power modules
are described, and the concept for a novel SiC power module is described.

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