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Invited Sessions

TRACK 1: HETEROGENEOUS INTEGRATION; MICROSYSTEMS
WITH DIVERSE FUNCTIONALITY

THURSDAY, AUGUST 31, 2017 11:00 am – 12:30 pm
Room: Montgomery, Second Floor

Dr. Pawel Keblinski 1-2-3 - New Frontiers in Materials – II

Rensselaer Session Organizer and Moderator: Prof. Ganpati Ramanath, Dr. Kaushik Mysore
Polytechnic Institute
Biography
Professor Keblinski received his Ph.D. from the Pennsylvania State University in 1995. Before
he joined Rensselaer in 1999 he was a postdoctoral researcher at Argonne National Laboratory
and worked at Forschungszentrum Karlsruhe in Germany as a recipient of an Alexander von
Humboldt Fellowship. Professor Keblinski is an author or co-author of 129 papers on topics
ranging from mesoscopic-level modeling of vapor deposition and phase separation to atom-
ic-level structure and properties of interfaces in metals, covalent materials and ionic ceramics.
Professor Keblinski’s work is focused on the relationship between microstructure and various
materials properties, such as mechanical response, diffusion, interfacial migration and phase
diagram, in particular, of nano-structured materials. A major goal of Professor Keblinski’s work is
to design and analyze computational models in order to gain insights into the nature of the
material behavior and properties. These insights are than used to formulate theoretical
concepts, to understand experimental results and to guide future experiments. Other interests
include connecting atomic-level modeling with electronic-level studies as well as with the
macroscopic description of the material based on constitutive models.

Heat and Interfaces in Electronic Materials

Abstract
An interface between two materials poses a resistance to the heat flow, which is addition to the
resistance of the bulk of the material. Consequently, materials with high density of interfaces,
such as supperlattices, nanocrytalline materials, and nanocomposites, can exhibit thermal
conduction that is far lower than values characterizing bulk materials with little or no interfaces.
Such thermal conductivity reduction can be advantageous, e.g., in the case of thermal barrier
coatings or thermoelectric materials, or detrimental, when the objective is to enable efficient
heat dissipation, as is the case for thermal interface materials. In my presentation I will discuss
factors determining heat flow across interfaces and the ability of the atomic-level simulation and
calculation techniques to shed light on the relative role of these factors, and the relationship
between interfacial structure and bonding and interfacial thermal resistance. Aimed with this
information and predictions of the continuum-level homogenization theories, I will discuss
design principles and for nanocomposite materials with good, or even superior, thermal
transport properties. Finally I will address the role of the liquid-vapor interface in high-power
density evaporative cooling applications.

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