Page 30 - ASME InterPACK 2017 Program

Panel Sessions

TRACK 1 11:00 am – 12:30 pm TRACK 4 4:15 pm – 5:45 pm

FRIDAY, SEPTEMBER 1, 2017 THURSDAY, AUGUST 31, 2017

Room: Mason I & II, Second Floor Room: Jackson, Second Floor

9-1-1 - 3D Packaging: Key Drivers, Opportunities and Challenges 9-4-1 - Wide-Bandgap Packaging, Thermal Management and
Applications
Session Chair: Bill Bottoms, 3MTS
Session Co-Chair: Kaushik Mysore, AMD Session Chair: Lauren M. Boteler, U.S. Army Research Laboratory
Session Co-Chair: Patrick McCluskey, University of Maryland,
Eric Beyne, Fellow & Director, IMEC College Park
Rama Alapathi, VP of Strategic Development, Amkor
Gamal Refai-Ahmed, Distinguished Engineer, Xilinx Isik Kizilyalli, Program Director, ARPA-E
Javier DeLaCruz, VP of Engineering, XPERI Corporation David Reusch, Executive Director of Applications Engineering,
Efficient Power Conversion
TRACK 2 9:15 am – 10:45 pm Avram Bar-Cohen, Principal Engineering Fellow, Raytheon- Space
and Airborne Systems
THURSDAY, AUGUST 31, 2017 Douglas Hopkins, Professor and PREES Director, North Carolina
State University
Room: Jackson, Second Floor Ty McNutt, Director of Business Development, Wolfspeed
John Oenick, Manager of Hybrid Vehicle System Development, John
9-2-1 - Servers of the Future Deere

Session Chair: Michael Patterson, Intel
Session Co-Chair: Reza Khiabani, Google

Dr. Mukesh Khattar, Technical Executive at Electric Power Research TRACK 5 11:00 am – 12:30 pm
Institute (EPRI)
Dr. Sukhvinder Kang, Chief Technology Officer, Aavid THURSDAY, AUGUST 31, 2017
Steve Branton, Senior Director for Data Center Solutions, Asetek
Room: Jackson, Second Floor

TRACK 3 2:15 pm – 3:45 pm 9-5-1 - Next-Generation Automotive Electronics: Reliability
Challenges
WEDNESDAY, AUGUST 30, 2017
Session Chair: Przemyslaw Gromala, Robert Bosch Gmbh
Room: Jackson, Second Floor Session Co-Chair: Pradeep Lall, Auburn University

9-3-1 - Flexible Hybrid Integration Challenges and Opportunities Prof. Sven Rzepka, Head of Micro Materials Center, Fraunhofer ENAS
Prof. Bongtae Han, Center for Advanced Life Cycle Engineering
Session Chair: Valerie Marty, Connected Micro LLC (CALCE), University of Maryland
Dr. Shalabh Tandon, Director IoTG Product Quality & Reliability, Intel
Manufacturing capabilities for emerging flexible technologies Matt Romig, Semiconductor Packaging Roadmap and Business
Dr. Anwar Mohammed, Senior Director, Flex Interface Manager, Texas Instruments
Dr.Yoshikazu Takahashi, Senior Chief Engineer, Fuji Electric Co., Ltd.
Aerospace perspective on challenges and opportunities related to Mohak Shah, Head of data science, AI research, Robert Bosch LLC
flexible hybrid electronics Azeem Sarwar, Senior Researcher Diagnostics and Prognostic, General
Dr. Benjamin Leever, Senior Materials Engineer, Air Force Research Motors
Laboratory

Opportunities for applications of biosensing in wearable form
factors
Ramune Nagisetty, Senior Principal Engineer, Anticipatory
Computing Lab, Intel

Computational modeling of multi-functional structures
Dr. Fu-Kuo Chang, Professor for Aeronautics and Astronautics,
Stanford University

30